Electronics Forum | Thu Apr 01 14:00:17 EST 1999 | Ron Beasley
| | Has anyone heard of a problem with catastrophic failure of | | large value (200uF) solid tantulum capacitors that have been | | exsposed to high humdity. | | | I suppose that with water moisture seep in the capacitor, the risk is very high tha
Electronics Forum | Thu Apr 01 21:18:31 EST 1999 | Chris Kelly
Glenn, There are both very good VOC-Free fluxes as well as alcohol based fluxes out there. This should be your primary focus if you are so lucky as to have to opportunity to actually select a flux! The use of nitrogen will benefit any no-clean pro
Electronics Forum | Mon Apr 05 08:25:31 EDT 1999 | ADRIANO FERNANDES
| | | I require some feed back from any one who knows about using a voc free flux in a nitrogen wave solder machine soldering both through hle and smt componants. | | | What disadvantages are there when using this flux? | | | Do you have any contact
Electronics Forum | Fri Mar 19 18:47:16 EST 1999 | John Gill
Hi Folks, This is my first surface mount board, so I asked our assembly house for some tips. They said only passives on the bottom side-preferably no smaller than 0805, 0603 only if I have to. I would think that an SOT-23 would be OK on the bottom.
Electronics Forum | Fri Mar 19 11:01:42 EST 1999 | Dave F
| Hi folks, | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and somet
Electronics Forum | Wed Mar 17 07:54:18 EST 1999 | K Williams
Hi I was wondering whether anyone could help me . I am looking for a report entitles ' The behaviour of solder pastes in stencil printing with vibrating squeegee' It was published in IEEE CPMT Transactions Part C Vol 21 No4 in October 1998 I know
Electronics Forum | Wed Mar 17 09:42:04 EST 1999 | Dave F
| Hi | | I was wondering whether anyone could help me . I am looking for a report entitles ' The behaviour of solder pastes in stencil printing with vibrating squeegee' It was published in IEEE CPMT Transactions Part C Vol 21 No4 in October 1998 |
Electronics Forum | Wed Jun 16 04:18:53 EDT 1999 | forrest xie
| | | we encounter BGA soldering issue. there is always some dry joint or unclear defects after reflow and the board can't pass electrical test, but if we resoldering it through hot air gun, every thing is ok. we use the "dog bone" surface pad ,that
Electronics Forum | Sun Mar 14 19:23:30 EST 1999 | Al
Can sombody help me with this?? When applying solder paste, what factors determine how high off the PCB the stencil is? We use no fine pitch devices. (mostly 603 and 1206 size components) Any help would be greatly appreciated. As you could probably g
Electronics Forum | Fri Mar 12 20:19:46 EST 1999 | Dean
| AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: | "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuards ar
