Electronics Forum | Mon Mar 29 07:21:51 EST 2004 | jdumont
We are also having the same problem here. I was told earlier that it could be a problem with the solder mask during the raw board manufacturing level but then I noticed that the problem was only surfacing on boards that went through the wave. As far
Electronics Forum | Tue Mar 23 20:55:00 EST 2004 | Dreamsniper
First Time to solder BGA's using Water Soluble. We are currently using an Aquaeous Cleaner to clean our PCB's but I find it not enough to clean the flux from under our BGA's. Has anyone had this experience before that he may like to share how he mana
Electronics Forum | Sat Mar 27 08:15:02 EST 2004 | davef
Via in pad is a designer's dream and an assembler's nightmare. Search the fine SMTnet Archives for previous discussions to get started. VIP, via-in-pad, or whatever tend to promote voiding within the via and certainly partially starved solder conne
Electronics Forum | Wed Apr 07 16:30:19 EDT 2004 | davef
Your customer is a screwball!!! Tell him / her that you'd be happy to do such testing for a fee, providing the customer: * Signs an unconditional waiver absolving you of liability claims now and in the future. * Takes responsibility for any and all
Electronics Forum | Tue Apr 06 11:17:01 EDT 2004 | ccl
hi, i encounter gold surface contam issue on wire bonding ring after prebake at 150 C for 3 hrs, tis cause wire bonding non stick issue. the contam seem begin at the solder mask area toward center of the bonding ring, but is not consistance.
Electronics Forum | Wed Apr 14 07:59:54 EDT 2004 | arcandspark
Makes a lot of sense, thanks for the excellent input. The peak temp I am running fo our pb free (238C and approx. 90 seconds above 183 C)is the recommended profile from T.I and also the solder paste manufacture. Not sure exactly what the melting temp
Electronics Forum | Sun Apr 18 06:49:10 EDT 2004 | Nick Prince
You might like to check ou the SSTC at the National Physical labs, in the UK. They have done a lot of research in mixing PB and PB free alloys. Its high Science stuff but intelligable. The upshot seems to be that if you mix PB and PB Free alloys th
Electronics Forum | Tue Apr 13 08:19:52 EDT 2004 | arcandspark
The PCB's we are seeing the voids on are made of some material called Thermount, not FR4. The pads are very easily pulled off if any touch up or rework is done. The voids I am seeing are (hugh) 50% to 75% of the Solder Ball volume. The last new batch
Electronics Forum | Thu Apr 15 20:55:36 EDT 2004 | Ken
Try: Tungsten, tungsten carbide, ceramics like boron-nitride or how about pyrex glass? Glass blowers could make "hooks" that connect to a cross bar. I would NOT use aluminum (even if anodized). Try stainless steel 316. 303, 304 do not have enough
Electronics Forum | Fri Apr 16 08:49:07 EDT 2004 | Chris Lampron
Hi Barry, Your best course of action is to perform a thermal profile and determine exactly what the times/temps are in these locations. Try to match your profile to the recommendations of your solder paste. (Time between 130-160, Time over 183 and m
