Electronics Forum | Tue Dec 09 14:01:05 EST 2008 | evtimov
Hi Steve, first you have to decide if you need adhesive or you can go with solder. Usually depends on the TH parts. Otherwise dispensing is always more problematic process than print. I would go with the printer and stay away from troubles. It is f
Electronics Forum | Wed Dec 10 16:15:24 EST 2008 | terryl
on the front end in design, minimize the pth connections to ground planes. this takes alot of work by the pcb designer and the approval of the design engineer. connect maximum of 4 ground planes to pth, minimum 1 plane. use spoked connections. ev
Electronics Forum | Wed Dec 17 09:55:10 EST 2008 | jorge_quijano
Hi to everyone, I will be runnig product with adhesive with a MPM UP2K, I'll use a 0.020" stepped stencil & metal blades. Is it better to use high speed for print head travel? more/less squeegee force than with solder? slow snap off? what could you r
Electronics Forum | Mon Dec 22 09:41:20 EST 2008 | evtimov
With Hot bar you can attach flet cables to PCB or to Displays. I beleave there are a lot of machines about that. The problem is in the jig which should be made for your particular board. If you define the process and the jig, with a very simple machi
Electronics Forum | Mon Dec 22 14:15:41 EST 2008 | ck_the_flip
As Emil says, it's 100% the glue! Your paste is not designed to hold parts on at wave solder. Reflow is MUCH hotter than glue, so I doubt you're not adequately heat-curing it. Possibly, the glue cure is "too hot" and maybe making the material brit
Electronics Forum | Thu Jan 15 12:32:08 EST 2009 | vleasher
After doing some more research it looks like Loctite made a material called Cornerbond 3515 that seems as if it has the characteristics we are looking for such as curing after the solder is liquidous. But it appears that it isn't manufactured anymore
Electronics Forum | Fri Jan 16 16:36:07 EST 2009 | boardhouse
i would not try to chemically clean the finish, you would just be asking for other problems. 1) I would ask your supplier their Hasl mix. Standard Lead hasl is 63/37 - it almost sounds like your boards have a higher content of Tin and your experien
Electronics Forum | Mon Jan 19 11:58:07 EST 2009 | slthomas
Like has been said, I would expect N2 to provide for shinier joints. On the other issue, which is it...O2 or compressed air? I would expect air to do nothing, and O2 might actually make your joints oxidize faster (duller appearance)...or blow up yo
Electronics Forum | Thu Jan 29 19:01:51 EST 2009 | stevek
Allow me a contrary viewpoint. I've had these things on my floor and had customers get outsourced evaluations done with them. Most expensive boat anchors I've run across. First the good points: The automated scanning and pattern recognition is go
Electronics Forum | Wed Feb 04 06:26:20 EST 2009 | sachu_70
Hi Peter, The defect you observe during the second side reflow could be caused due to improper Au plating thickness in the PCB fabrication process. You can refer IPC-2221 wherein plating thicknes for ENIG mentions 0.08um to 0.23um for Immersion Gold,
