Electronics Forum: solder (Page 1766 of 2099)

PAD come off from PCB after Rework

Electronics Forum | Fri Apr 21 18:02:16 EDT 2006 | SD

You didn't explain exactly how you are reworking the BGA and at what point the pad comes off. Assuming it's from an iron... The biggest cause of lifted pads is too much heat. Whether it be the iron temp or the amount of time the iron is on the pad

AOI for defect detection at soldering process

Electronics Forum | Wed Aug 30 07:34:23 EDT 2006 | Xray Tester

For Automated x-ray inpsection system comes in 2D and 3D. 2D also know as the transmission xray inspection where xray are generated from a fixed point source. On double side board, this does not work that well. That where 3D Automated x-ray inpsectio

Immersion Tin

Electronics Forum | Thu Apr 20 07:53:24 EDT 2006 | Yanick

Hi, I'm just wondering if someone have more information about board with immersion tin plating. I search in the archive but didn't find anything interesting. We try it, and we have difficulties to make a good solder joint with the wave. And wi

Couple interesting articles on lead-free

Electronics Forum | Tue May 02 12:13:59 EDT 2006 | patrickbruneel

Grant, Non of the articles state that lead-free will go away (unless I missed something). I've never heard it being a problem souring lead-free components only leaded components. But I have to admit not being on the manufacturing floor on a daily ba

Tip life of soldering irons with lead-free (SAC305)

Electronics Forum | Mon May 15 11:25:10 EDT 2006 | muse95

Since when is Hakko putting more plating on their tips? I was told that there was no change to their tips, it was the same tip for Pb or Pbfree. Prior to first use, all Hakko tips are Pbfree. We have been seeing those tips degrade quicker with Pbf

IPC-A-610D Question

Electronics Forum | Tue May 02 14:56:57 EDT 2006 | Tim

8.2.5.5 Flat Ribbon, L, and Gull Wing Leads, Maximum Heel Fillet Height (E). For class 3 the heel fillet cannot touch the body of a plastic component, except for SOICs and SOTs. Why is my question? What type of failure will be the result of solder

IPC-A-610D Question

Electronics Forum | Tue May 02 16:37:57 EDT 2006 | bhall

I have experienced the exact same problem with excess solder touching the plastic component body. The solution in my case was simply to replace the stencil. I was using a reusable stencil frame that had been worn out. I replaced the stencil with a so

Is anyone using K100 bar solder? Why or why not?

Electronics Forum | Mon May 15 11:16:10 EDT 2006 | timnop

In an attempt to re-establish this thread as a serious request for professional experience and opinions on the Kester K100LD product, let me ask again!..... Have any of you professionals out there tried this product and if so, what was your experienc

First documented case of tin whisker formation

Electronics Forum | Mon May 15 05:17:18 EDT 2006 | Rob

Hi Patrick, Sorry, wrote it in a hurry on Friday afternoon, I meant show us evidence of a scientific trial on all or at least some other alloys. I accept Tin whiskers and other similar phenomina exist, I even accept that the whole ROHS directive

First documented case of tin whisker formation

Electronics Forum | Mon May 22 10:50:52 EDT 2006 | patrickbruneel

Hi Rob, I'm not sure if you're kidding or not Are you moving to Australia? Here's a link to the text John Burke used to write the EU commission for an exempt on lead in solders on environmental grounds. (Supporting documentation links on the bottom


solder searches for Companies, Equipment, Machines, Suppliers & Information