Electronics Forum | Wed May 09 11:05:26 EDT 2001 | davef
IPC-7525 "Stencil Design Guidelines" �9 END OF LIFE, states "Stencils should be inspected periodically for damage that would conribute to decreased printing performance. Refer to Section 7 for inspection guidelines." Or words to that effect. Now b
Electronics Forum | Tue May 22 23:49:58 EDT 2001 | jones
I've never tracked the life of a stencil, but if your seeing an decrease in the life of your stencil you may want to look at the printer itself. What kind of printers are you using? I'm more familiar with MPM screen printers and I have seen were cert
Electronics Forum | Mon May 14 14:51:36 EDT 2001 | Brian W.
Personally, I prefer the OSP. I get a flat surface to deposit paste on, resulting in more consistent solder paste volumes. With HASL, the amount of plating and the mounding affect the paste deposition. I have even had it affect the placement. The
Electronics Forum | Mon May 14 17:16:27 EDT 2001 | slthomas
We use both, cartridges for water soluble and jars for no clean. The only reason we do is so they can't possibly (knocking on my head) mix it up. Pros: Jar - you can put paste back into it if you want to wash your stencil, change jobs after lunch,
Electronics Forum | Wed May 16 08:48:12 EDT 2001 | ohboy
I been a bunch o' places...! Some good, some bad, re-inventing the wheel in many cases. Our specs are pretty specific in a lot of cases, but that doesn't mean they always get followed. It usually becomes a case of "It's not quite right, but we rea
Electronics Forum | Mon May 21 17:37:51 EDT 2001 | davef
IPC-2222, Sectional Design Standard For Printed Board For Organic Printed Boards talks to scoring parameters in para. 5.3.1. You can obtain the standard at: http:///www.ipc.org. and Document Center [http://www.document-center.com/home.cfm/sid=71285
Electronics Forum | Fri May 25 17:25:25 EDT 2001 | morefun
Is anyone out there is the contract or the OEM sections using viscometers to check solder paste or glue for acurate process definitions. By this I mean check the materials viscosity over a period of time and measure the degradation of performance, t
Electronics Forum | Tue Jun 05 20:25:27 EDT 2001 | davef
Sorry that I'm so late responding. Your new additon probably has 'backee stains on the floor already. Assuming we're talking about a fairly standard board assembly area, you don't need to specify air quality. 1 We specify * Particulate: Level to b
Electronics Forum | Fri Jun 08 14:19:35 EDT 2001 | Spanky
Jake, The No-cleans on the market, to me, still aren't as good as OA and water wash. But they have gotten better. The type of No-Clean flux and paste to use really depends on each individual assembly, the machines used, settings, and the environme
Electronics Forum | Mon Jun 11 22:01:30 EDT 2001 | davef
Others make good points. Consider "TP-1115 - Selection & Implementation Strategy for A Low-Residue No-Clean Process" as a starting point. Remember that in-bound components and boards can be loaded with unNC res that can turn the best implemented
