Electronics Forum | Fri May 30 18:57:44 EDT 2003 | russ
We place a large amount of .4mm (what is that in microns?)QFPs every day. I would much prefer a BGA package. Reasons are 1. Pitch is greater which provides a larger process window 2. Alignment is easier because you don't need vision for BGA if you
Electronics Forum | Wed Jun 04 14:33:28 EDT 2003 | joeherz
CAL, Thanks for the input. When I said chemistry I was refering to soldering chemistry and not cleaning. I believe this machine has the capability to incorporate a saponifier but would prefer not to run in this manner. Running a closed loop DI re
Electronics Forum | Fri Jun 06 07:23:18 EDT 2003 | johnw
Hi Kevin, the profile doesn't actually qualify something as lead free or not it's purely the Pb content of the assembly that does this. Currently the understanding of the limitations of the lead in the jont is 0.1% by weight or less. So as long as y
Electronics Forum | Thu May 06 19:56:30 EDT 2004 | bruceatknoll
Here is some more info with regarding my Wave. 1. PCB .065" thick 2. leed length .20" (.135" protrution) I know this is high but we use many thousands and cutting each is not practical. 3. no clean flux by way of foam fluxer 4. wave machine is a HOL
Electronics Forum | Wed May 12 08:27:43 EDT 2004 | solderpro
woow, looks like I need to go back on the road... you all have great info. but what happen to asking what type of machine do they currently use, what is the configuration of the machine, what type of flux are we using, are running single sided or dou
Electronics Forum | Wed May 12 12:01:11 EDT 2004 | solderpro
Now we are finally breaking the ice, glad to meet you greg, once again did not mean to offend any one and glad to have guys like you on the chemistry end of things... have no problem with the pp file, its mainly set up to help those with issues like
Electronics Forum | Fri Jul 04 01:32:15 EDT 2003 | rheise
I've seen numerous incidences of mirror image cracking under endcaps in high dielectric material ceramic capacitors due to thermal cycling. If the cracking is deep enough to extent through the plates you can get breakdown and shorting. Section the ca
Electronics Forum | Wed Jul 30 19:13:29 EDT 2003 | Steve Gregory
Be carefull about thinking that a hot air knife is going to be a cure-all to your problems. They may work in SOME situations. I have an Electrovert Electra that has a hot air knife, and to be perfectly honest, it creates more issues than it solves...
Electronics Forum | Thu Jun 26 21:38:31 EDT 2003 | Dreamsniper
Hi Guys, Need your good advice about this for a 5 thou stencil thickness: 0603 pad is 50mil x 40mil 0805 pad is 75mil x 45mil 1206 pad is 70mil x 50mil I want the above apertures to be in IPC STD Homeplate Design + an area reduction of 15%. Will t
Electronics Forum | Wed Jul 09 04:57:11 EDT 2003 | Matt Kehoe
Our company applies solid solder to surface mount lands. While processing a micro BGA design we had some pads fall off, peel, whatever you might call it, from the surface of the board when touched "GENTLY" with the tip of a blade to remove a small s