Electronics Forum | Wed Aug 07 13:46:18 EDT 2019 | tey422
I have a question regarding is there any trick/tip able to quickly identify if a component is not clean/washable? Or a list of mfg p/n which already know are not clean/wash? We have an assembly would need to change the process from No-Clean to Clean
Electronics Forum | Mon Aug 19 13:32:54 EDT 2019 | aqueous
ROSE testing a post-reflow assembly which has been reflowed using no-clean flux may not yield information that is helpful. No-clean flux technology works by encapsulating the flux's activators and other chemical constitutes that would be harmful if l
Electronics Forum | Wed Aug 26 18:36:17 EDT 2020 | serge_pirog
Hello. Could I ask you for help. We have DEK Europa. We have changed ProFlow to squeegee head with feedback. After this during solder paste printing system shows the difference between set pressure (9 kg) and real pressure (7,5kg). I have read manual
Electronics Forum | Wed Dec 04 12:42:04 EST 2019 | dunks
We currently use Kester's ep256 as well and it seems to be a bit more grainy than one would expect from lead, especially if the temperature is too low. That paste says it's specialty is being robust over a wide range of profiles and stencil conditio
Electronics Forum | Tue Dec 17 14:11:43 EST 2019 | kylehunter
Haven't run those boards again, so haven't had the issue.. Since it seems like we may want to start using more aggressive flux based paste soon, what are some good choices? Ideally I'd like to stay with Kester, since they are readily available. EP2
Electronics Forum | Mon Jan 06 20:53:23 EST 2020 | mikeyg12
Hello everyone! I have had this idea in my head to DIY a desktop KVM (without the V so I guess just a KM) board that I can solder USB A headers to with a DPDT switch. I designed the board and when I thought it was all good to go I proudly sent it of
Electronics Forum | Mon Feb 10 10:41:29 EST 2020 | SMTA-Tony
Hello Phil, As the other respondents have mentioned, the cooling rate is not easily controlled and varies based on the oven and board design, as well as the settings of the last few zones and cooling zones. In general, the board is going to cool in
Electronics Forum | Tue Feb 11 10:51:20 EST 2020 | slthomas
To predict whether or not a first pass part is going to come off during the second pass you need to calculate the ratio of weight/soldered surface area. According to a couple of different sources that I've dug up, maximum is around 44 grams/in.^2. I
Electronics Forum | Wed Mar 18 11:27:24 EDT 2020 | slthomas
I am about to order a stencil and I can already see that I'm going to have issues. I'm hoping someone has a recipe for this scenario that we haven't tried yet. The parts are 16 mil pitch bga's, the pads are NSMD (10 mil dia. with 12.6 mil mask open
Electronics Forum | Fri Apr 03 08:34:54 EDT 2020 | SMTA-Gregory
We need to be careful with product to avoid introducing a new failure mode, namely corrosion and dendrite growth, especially those running no clean processes! In addition to heat (reflow, wave and some selective soldering processes) killing the vi
