Electronics Forum | Mon Jun 10 13:31:29 EDT 2013 | emeto
Is there anything on the other side of the board? If not the process will be very standard. 1. SMT - place the small parts on your board. It is called surface mount technology. Basically one machine applies solder paste on the board, another machine
Electronics Forum | Mon Jul 29 19:39:57 EDT 2013 | hegemon
No problem running lead free without nitrogen. Careful profiling will take care of the soldering. Cosmetically, the Nitrogen reflow is superior for lead free, and we see much better wetting, better coverage of the PWB pads, and of course the smooth
Electronics Forum | Fri Oct 04 16:08:28 EDT 2013 | hegemon
Same idea but simpler execution. Verify Solder pot temperature. Verify Temperature of Solder as it leaves the nozzle. Verify preheating gets your PWB up to 90C-120C prior to soldering. Check machine speed, verify 4 seconds contact with solder at
Electronics Forum | Thu May 14 05:20:31 EDT 2015 | kielbik
Hi Im looking for a person who have a experience with Intel® Core™ i3-5157U (i5) Processor soldering (CL8064701478404). I want to compare our experience because i'm not sure about aur spare parts and our soldering way. They are original or not, becau
Electronics Forum | Fri Oct 02 09:22:24 EDT 2015 | derrikf
The following is representative of on-board temps of a FR4 at .069" thickness. The thermal couples were soldered directly to the board using high-temp solder. Again, the halogen-free solder requires an identical profile to our old solder. We had grea
Electronics Forum | Mon Dec 21 09:58:34 EST 2015 | dyoungquist
We are using Metcal STTC-8xx series tips. One thing that makes a huge difference on tip life is what type of solder you are using. If you are soldering with lead (SnPb) solder the tips will last 3 times longer on average than if you are soldering w
Electronics Forum | Mon Nov 13 14:58:56 EST 2017 | davef
Determine the origin of the solder * Sloppy paste printing technique * Lax stencil underside cleaning practices * Sloppy misprint cleaning practices * Poor part placement practices creating solder balls * Poor material control allowing solder p
Electronics Forum | Wed Aug 01 08:58:02 EDT 2018 | 2219576
Please check the solder paste height near PCB edges, Please check board clamping during solder paste printing. Please check tooling support boards must be fixed during the printing process. try to set wiper cleaning frequency and fine tune for best
Electronics Forum | Wed Dec 09 18:51:06 EST 2020 | johndep7
My company has been having issues with a lot of solder balls, solder splash, and flux balls all over a specific board. Now this is one of the only companies that require us not to clean our boards after our work is finished but this is also causing a
Electronics Forum | Thu Sep 07 15:20:58 EDT 2023 | rjroaquin6
Hello All, I recently had a case of excessive tin coming from a solder pot sample. The solder is SN63 but the results of testing had a 64.97% for Sn. The J-STD-001 spec is 61.5% to 64.5%. The pot is used to pre-tin wires which will then be solder
