Electronics Forum | Tue Aug 25 13:30:35 EDT 2009 | rossi
It appears that the crack is between the paste and the ball. We physically pulled off the BGA by force and almost all the balls broke at the PCB. There was a thin layer of solder left on the pad. Maybe 1% of the balls stuck to the pad. I have attac
Electronics Forum | Mon Aug 24 11:41:41 EDT 2009 | tds
I rebuild solder recovery systems that are used during the dedrossing of solder machnes. My number is 330-724-3333. We have sold a lot of these machines and have plenty of references. Scott Wilson
Electronics Forum | Tue Sep 01 11:05:36 EDT 2009 | saisungold
We gold plated PCB and while soldering, the adhesion of soldering is not uniform at the tips(soldering ends). Please help us to solve the problem.
Electronics Forum | Mon Oct 05 18:53:08 EDT 2009 | smt_guy
this is what they call hybrid soldering....i missed the discussion at the IPC Show in Chicago... Can someone with hybrid soldering idea share some? thanks
Electronics Forum | Mon Oct 12 14:50:48 EDT 2009 | kircchoffs
Hi, please recommend a good selective wave machine which is fully automated and can run a conventional solder and selective solder in 1. im currently looking at Ersaflow. thanks
Electronics Forum | Thu Dec 24 10:34:51 EST 2009 | davef
isd.jww: First, the original poster is talking about pads, not component leads. Second, you're correct that chrome plated component leads can be attached by spot welding or crimping a solderable tab to the lead and then soldering the tab to the boa
Electronics Forum | Fri Dec 25 08:39:48 EST 2009 | davef
Compared to 63/37, solder with high tin content: * Requires higher reflow temperatures * Demands tighter process control * Results in duller, more grainy looking solder connections Tell us about the specific problem that you seek help in solving.
Electronics Forum | Fri Jan 08 02:25:42 EST 2010 | graceytiu07
Happy New Year to All: Has anyone of you encountered a solder short on QFP pin yet there's no evidence of bridging in between gaps? I am using an SnPb solder paste.
Electronics Forum | Fri Mar 05 04:19:03 EST 2010 | aungthura
Ya, that could be happened bcoz of reflow profile.I think, in this case, each lead got the different temperature during the reflow process. If the solder had melted properly,the hot lead would have attracted the solder to cover itself.
Electronics Forum | Fri Mar 19 16:13:00 EDT 2010 | davef
The aluminum material is typically plated by a zincation process, followed by nickel plate and a gold flash layer. What do the soldered side of the component and the soldered side of the aluminum coin look like? Do they both take solder?