Electronics Forum | Fri Dec 04 23:15:45 EST 2015 | mac5
You say that there is no green solder mask around the lands of the BGA only silk screen. If that is the case I would be concerned about the solderabilty of the component if the silk screen gets onto the pads. The application of solder mask is much mo
Electronics Forum | Mon Aug 29 08:44:57 EDT 2016 | jrrt_williams
As an OEM repiar tech I would run into "Black Pad" on occasion, though mostly on surface mount pads. The only way I could remove the oxidation was to apply water soluble flux and add solder, then wick away the excess. This left me with a suitable s
Electronics Forum | Wed Jun 22 01:57:28 EDT 2016 | sachinverma
we face the problem to last month dry solder issue.when we found PCB is dry. (PTH not fill not properly)then we change the parameter like flux Tank pressure increase 130 to 250. after these activity PCB is ok no dry solder found......but problem is o
Electronics Forum | Thu Sep 29 18:57:14 EDT 2016 | vchauhan
Is it ok to re-print the mis-print PCB? Personally I am oppose to re-print the mis-print board. For two reasons. 1. You will end up adding solder paste on the bottom side of the stencil. 2. You may smear solder paste in some area. But I would like to
Electronics Forum | Wed Feb 08 03:24:00 EST 2017 | soldertraining
Tin dipping of components in RoHS compatible solder is one means to turn the lead bearing components in to devices which can be used in a RoHS compatible soldering process. The conversion of lead bearing components into those which can be used in the
Electronics Forum | Thu Apr 20 02:17:15 EDT 2017 | cromaclear
Hello to all, I am having a serious problem on my ersa versaflow 3 machine. This is a selective soldering machine and a problem is in less soldering material on the pins, you can see it in the picture http://imgur.com/a/FC2a1 Do you have any idea how
Electronics Forum | Thu Apr 20 02:27:11 EDT 2017 | pavel_murtishev
Mile, Please tell me more about your soldering process: - Are soldering process parameters the same for all three pins? - Is unsoldered pin connected to thermal heavy copper polygon? - What is your board surface finish? HASL? - Sn/Pb or LF process?
Electronics Forum | Wed Jun 21 09:22:29 EDT 2017 | emeto
Hello, I have an assembly that I am considering to run in a regular process(SMT, Wave)and afterwords solder 22 electrolytic capacitors. Due to the multi-layer board it is not an easy task, so I was wondering if you guys know any trick how to do that
Electronics Forum | Wed Jun 21 11:18:57 EDT 2017 | capse
Hello, > > I have an assembly that I am > considering to run in a regular process(SMT, > Wave)and afterwords solder 22 electrolytic > capacitors. Due to the multi-layer board it is > not an easy task, so I was wondering if you guys > know any t
Electronics Forum | Thu Aug 10 07:29:43 EDT 2017 | stivais
How do you evaluate the soldering quality for those QFNs? X-Ray or AOI? For some QFNs (and other bottom termination components) it's not supposed to have solder fillets on toes. It's also noted in IPC-A-610 (Rev.F 8.3.13). Take a look at your QFN ch
