Electronics Forum | Tue May 03 13:59:04 EDT 2005 | Serge Richard
Is there a justification to buy a selective soldering in a high mix/low volume production? Which machine do you recommend?
Electronics Forum | Wed May 04 10:36:20 EDT 2005 | Rob
Hi Hannu, Just out of interest, are these big, heavy transformers, where the weight of lead in the solder will be less than 0.2% of the overall weight of the dipped part?
Electronics Forum | Mon May 23 13:26:34 EDT 2005 | pjc
Dave, On the SolderSaver, My business partner was given a demo on this thing back in 2000. He said: "It worked but had a tendency to kick up dross dust into the air, but it sure did separate the good solder from the dross." Pete
Electronics Forum | Fri May 27 06:59:08 EDT 2005 | Rob
A bad solder joint, usually caused by a lack of knowledge & experience, possibly stemming from getting everyone else to do your home work!
Electronics Forum | Tue May 31 10:58:31 EDT 2005 | davef
There are a host of possibilities. Virtually any fabrication process prior to outer layer manufacturing prior to HAL could contribute to dewetting. That goes all the way to excessive brighteners in the copper plating line. Anything that prevents the
Electronics Forum | Tue Jun 21 14:36:33 EDT 2005 | tds
Please go to http://www.purexltd.co.uk for information on fume extraction. If you have any questions please give me a call @ 330-724-3333 Scott
Electronics Forum | Fri Jun 17 00:32:12 EDT 2005 | ajaydoshi
I saw detail of machine beamwaork spark 400. I find based on detail that it is very compact machine & can do solder pasting, placement, soldering , inspection in one machine. Is any one using this machine, how is performance & output of machine. aja
Electronics Forum | Thu Jun 23 00:28:42 EDT 2005 | KEN
....how does the part perform in a wetting test. Is it solderable on a bench or dip-plating in a pot? If you add flux and heat can you fix your problem assemblies? If yes, plating finish or substrate is not your problem. What flux are you using?
Electronics Forum | Sat Jun 25 10:04:08 EDT 2005 | ktron
Hi MSK, Stencil thickness: 5mils with laser cut Smallest pitch: 20mils Underscreen cleaning frequency: 10 bds per cleaning Note: We have decreased the cleaning frequency from 10 boards to 3 bds to reduce solder bridging after printing Regards,
Electronics Forum | Thu Jul 07 18:03:27 EDT 2005 | russ
Sarag, FYI tombstoning is a functional failure. Tombstoning is where one end of the component is not soldered and is in the air above the board/solderjoint surface. You may be thinking of billboarding (part on its side with both ends soldered down)
