Electronics Forum | Fri Sep 21 10:35:37 EDT 2012 | davef
Flash gold is just thin electrolytic gold plating over electroless nickel or electrolytic nickel. Flash gold plating ... * Less than 3 microinch thick will be porous and take solder poorly * Greater than 10 microinch thick will cause brittle solder c
Electronics Forum | Tue Nov 06 09:31:31 EST 2012 | swag
We also have 2 ACE machines. Great machines, good support. Keep them clean and do the maintenance on the solder pots and pumps and you'll have no issues.
Electronics Forum | Thu Nov 29 11:27:59 EST 2012 | zero260n4
I was asked a question; if you are doing a DFM on a solder paste layer what do you look for? it stumped me
Electronics Forum | Wed Dec 05 18:14:27 EST 2012 | cnotebaert
is wave soldering the only option? Depends on design? can you use a pin in paste process to accommodate SMT and through hole? are you in full control of your design?
Electronics Forum | Tue Feb 26 14:39:19 EST 2013 | eniac
Hi, guys. Does anyone use a EBSO selective soldering machines? Can you write your parameters for two rows connector? Thx!
Electronics Forum | Tue Jan 15 10:53:18 EST 2013 | boriskilk
We wouldn't advocate extending the soldermask beyond the component body but yes to ganging for fine pitch. To ensure we don't run into issues with flaking our preference is not to add solder mask when the space between pins is less than 6 mil.
Electronics Forum | Thu Feb 07 08:10:12 EST 2013 | emeto
Thank you all for the input. There is another concern. Do you consider wave soldering or selective soldering as a thermal cycle too?
Electronics Forum | Tue Mar 05 11:51:36 EST 2013 | aj
Hi all, Would welcome comments relating to Hot Bar soldering... Best equip suppliers and things to look out for... Also, is there a machine with multiple heads instead of having to change heads for each different size? aj...
Electronics Forum | Sat Mar 23 23:07:02 EDT 2013 | dhanish
I have a question on component placement 1)for solder paste ,do we need to press the component into solder paste during placement process? 2)how we define force for Smt component..sometimes we add force for certain BGA?any guideline? Pls advise
Electronics Forum | Tue Apr 09 10:50:11 EDT 2013 | emeto
Hello everyone, I am curious if you label your solder paste jars with additional label. We want to use our own label showing when the paste was opened and how many hours it was exposed. Any thoughts will be appreciated. Thank you!
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