Electronics Forum | Mon Sep 25 20:00:02 EDT 2023 | fuji_user_2014
I need to remove solder mask from a ground plane for rework purposes. What is the best method for doing this in the scale of 1000-1500 units? Recommended tools?
Electronics Forum | Mon Oct 09 21:22:10 EDT 2023 | emeto
You can try expensive wash pallet that protects the part in question, or you can solder with NC solder after all wash is done.
Electronics Forum | Fri Oct 27 08:24:41 EDT 2023 | avaqsemi
When designing a PCB to accommodate an intrusive reflow narrow profile connector (electrode rectangular) with specific dimensions, you'll need to consider the pad size, hole size, and other factors to ensure proper solderability and mechanical stabil
Electronics Forum | Thu Sep 30 03:17:45 EDT 1999 | Brian
| Hi everyone, | | Greetings! | | I�ve got a 2-layered through-hole PCB�s having the following problems: | | Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB | Insufficient Solder and some solder ne
Electronics Forum | Thu Jun 03 10:53:09 EDT 1999 | Ryan Jennens
| | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We ca
Electronics Forum | Thu Jun 03 13:00:16 EDT 1999 | Earl Moon
| | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We
Electronics Forum | Sun May 30 08:50:42 EDT 1999 | Dave F
| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect
Electronics Forum | Wed Dec 23 11:42:46 EST 1998 | Earl Moon
| | Folk's, | | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colour, text
Electronics Forum | Wed Dec 09 10:02:10 EST 1998 | Earl Moon
| Does anybody out there have any special insights into utilizing no clean paste in high frequency RF applications? I would imagine there may be some issues with solder balls that would affect functional test (Earl, do you have something for me here?
Electronics Forum | Fri Sep 18 08:49:12 EDT 1998 | Earl Moon
| | We have problems with voids when we solder lids to | | ceramic flatpackages. | | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | | The solder is attached to the lid (preform) and the solder
