Electronics Forum | Wed Apr 14 13:37:56 EDT 1999 | Mark Charlton
Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? I consider "fines" individual unmelted metal spheres that are found in solder
Electronics Forum | Thu Mar 25 02:22:32 EST 1999 | P.L. Sorenson - Technical Consultant
| | | Your problem may be related to silver migration (leaching) into the solder. I had what seems to be a similar problem. The solution was using solder with 2% silver content. See these pages for a bit more information: | | | | http://www.ferr
Electronics Forum | Thu Mar 25 13:53:28 EST 1999 | Bob Willis
| | | Your problem may be related to silver migration (leaching) into the solder. I had what seems to be a similar problem. The solution was using solder with 2% silver content. See these pages for a bit more information: | | | | http://www.ferr
Electronics Forum | Mon Mar 01 12:50:47 EST 1999 | justin medernach
| Hello! SMT professionals, | | I do not know if anyone posted this question before. | Last week, I reflowed our newly designed thin Rigid-Flex pcb with 0.040" thickness. I found all of pins of a TQFP48 ic did not get wetted. I could see on the hee
Electronics Forum | Tue Feb 02 08:37:32 EST 1999 | Chris G.
| Hello Everybody: | | I am in urgent need of some information regarding the reflow profile for a flip chip wafer. Would the reflow conditions along with the flux used affect the appearence of the solder joints. | | We are witnessing dull solder j
Electronics Forum | Wed Jan 27 21:02:53 EST 1999 | Dave F
| i am working with the noclean process and getting white residues on the bottomside of the board probably due to the | wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated temperatu
Electronics Forum | Thu Jan 28 08:58:10 EST 1999 | Peet
| | i am working with the noclean process and getting white residues on the bottomside of the board probably due to the | | wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated tempe
Electronics Forum | Tue Dec 29 11:40:24 EST 1998 | Michael Allen
I don't have answers...just comments. We're just starting to assemble CSPs on protos, and I've got the same concerns you have. The MicroBGA package I'm working with has a ball diameter of 0.325mm (0.0128") and a standoff of just 0.010" BEFORE solde
Electronics Forum | Thu Nov 12 03:58:10 EST 1998 | Earl Moon
| What are the factors that go into determining PCB Board temperature requirements for the Wavesolder process? Most of the recipes I've seen call for preheating the PCB to around 230F - 250F. This temp is about 210F - 230F below the typical solder te
Electronics Forum | Thu Oct 22 01:43:43 EDT 1998 | Frank J. de Klein
| My company is looking for higher density for card layout. One suggestion has been locating active components packaged in SOT's and SOIC's on the B-side of the card. This in turn will require wave soldering of the above mentioned components. When I