Electronics Forum | Fri Aug 21 13:45:12 EDT 2009 | rossi
We are using a vapor phase oven which we have used successfully for a number of years with both leaded and unleaded solders. Recently we experienced problems with a no lead BGA that has low silver balls. The problem is that the soldered boards do no
Electronics Forum | Sat Aug 22 05:19:42 EDT 2009 | ghepo
Dear Eric, in my opinion this is a very complex problem, that require to know many details for answer. For example : 1) what about the PCB finishing ? Have you verify the quality of they ? 2) what about the solder paste (the exactly composition)? 3)
Electronics Forum | Tue Aug 25 10:56:36 EDT 2009 | ghepo
Eric, the problem is a crack of the nickel PAD, or is a PILLOW defect ? See the photos annexed.
Electronics Forum | Tue Aug 25 20:13:52 EDT 2009 | tstrat
250C. Neither of the package or PCB appear to be warping during reflow.
Electronics Forum | Thu Aug 27 15:59:13 EDT 2009 | rossi
Thank You for all your help. Eric
Electronics Forum | Thu Aug 27 16:17:16 EDT 2009 | rossi
Thanks Jim. Can you tell me how you resolved/corrected the issue? Eric
Electronics Forum | Mon Aug 31 03:18:27 EDT 2009 | grahamcooper22
What is the boiling point of your vapour phase solvent ?
Electronics Forum | Fri Aug 21 17:44:43 EDT 2009 | joeherz
Contact Mike Gunderson at Marc Technologies - mike@marctechnologies.com.
Electronics Forum | Tue Aug 25 20:46:39 EDT 2009 | davef
We need more information and possibly a picture in order to help you.
Electronics Forum | Wed Sep 09 09:57:15 EDT 2009 | mikesewell
You mention silver pcbs - baking will accelerate oxidation/tarnishing of the finish. Solderability will likely go down...
