Electronics Forum | Fri Dec 07 02:55:24 EST 2012 | aj
I am no expert but would using a smaller nozzle help in anyway?
Electronics Forum | Wed Dec 12 16:16:39 EST 2012 | tombstonesmt
Nitrogen at nozzle supply is at around 47.5cfh.
Electronics Forum | Fri Feb 08 09:52:20 EST 2013 | emeto
Hegemon, my thinking was pretty much the same. I will probably not consider Selective soldering as a temp cycle. Thanks!
Electronics Forum | Thu Feb 21 12:49:07 EST 2013 | deanm
We had the same problem with one of our boards with ground planes so that it required preheat using a hotplate before hand soldering. Then I learned about the Metcal MX-5000 series soldering irons. I was skeptical at first but we can now solder the s
Electronics Forum | Wed Apr 03 04:14:10 EDT 2013 | sdhmuni12
Thank you
Electronics Forum | Thu Apr 25 12:46:53 EDT 2013 | emeto
Hi, I attach two pictures for you. Hope they help
Electronics Forum | Fri Apr 26 08:04:16 EDT 2013 | emeto
These numbers show liquidus temperature in C for each alloy combination.
Electronics Forum | Mon May 20 09:24:32 EDT 2013 | davef
SAC / Ni interface is the IMC (Cu, Ni)6Sn5
Electronics Forum | Mon May 20 22:13:45 EDT 2013 | ultimatejoker
So u mean it is to form the intermetallic compound which is (Cu,Ni)6Sn5?
Electronics Forum | Mon Oct 21 19:17:23 EDT 2013 | hegemon
The first picture shows an issue. Note that the vias adjacent to the interior rows are filled with solder. At the outside rows this is not evident. What you might have are interior spheres that are smaller in volume than the rows on the outide, si