Electronics Forum | Fri Sep 13 14:35:03 EDT 2002 | davef
Thanks Bernard. On your profile: Adding gold to your solder alloy will increase the liquious temperature. So slowing your reflow oven conveyor is a perfectly reasonable approach, especially for pads with low surface area. We don't even notice a di
Electronics Forum | Tue Sep 17 12:55:42 EDT 2002 | ksfacinelli
This is what is referred to as a butterfly product connectors on both sides we are experimenting with different production techniques but we are currently having to hand solder these parts. Today however we are needing a solution to fit an iron in a
Electronics Forum | Wed Sep 18 06:53:05 EDT 2002 | CH
1) For solder short, pls check the paste height. Too much vol will cause short. For 15 mils use 5 mils thickness stencil if possible. Check profile preheat time to prevent hot slumpof the paste. 2) type 4 powder will be better for 15 mils pit
Electronics Forum | Mon Sep 30 09:00:26 EDT 2002 | arcandspark
Russ, I have been reworking BGA's for over five years now and have never been able to remove voids in the solder balls without removing the BGA itself. Your thermal profile can also cause the voids along with a poor solder paste. I have experimented
Electronics Forum | Wed Oct 09 08:51:34 EDT 2002 | pjc
No, wouldn't want to, wouldn't be prudent. Best process I think is to solderpaste reflow the TSOP components then mask them for the wave. Mask using liquid type soldermask or a selective solder pallet. Or, if you must, the only way I can see any dece
Electronics Forum | Tue Oct 15 08:27:31 EDT 2002 | davef
I can't comment on 20 pitch TSOP, but wave soldering wider pitch parts require: * Orienting components with the leads perpendicular to the wave [moving parallel to the rails]. * Thieving [robbing] pads on trailing pads for the component. Search the
Electronics Forum | Thu Oct 03 04:04:10 EDT 2002 | Bob Willis
SMTNet has a video tape and interactive CD ROM on Intrusive Reflow Soldering that you may want to check out. In addition there are some free inspection standards for pin in hole printing, placement and soldering available at http://www.dpmo-monitori
Electronics Forum | Fri Oct 04 12:02:53 EDT 2002 | mzaboogie
Hi Barry, One consideration that you may want to consider is the lead to hole ratio. The higher the ratio, the less solder is required to fill in the gaps and give you a fillet. Heat is a concern. You will need to ensure components will take the he
Electronics Forum | Wed Oct 16 17:25:09 EDT 2002 | kenbliss
Since all seriousness seems to have disappeared on this thread. I can�t wait to see the new headline slogan Nepcon West 2002 the longest running assembly show, learn the latest techniques in PC board assembly, wave soldering, and frying twinkies.
Electronics Forum | Tue Oct 15 10:46:47 EDT 2002 | Dan Davis
I have a supplier that utilizes a soft beam solder process for through hole components. We are experiencing bridging and cold joints on components with narrow pitch between pins. They are dragging the solder over these pins as well. I have asked f
