Electronics Forum | Mon Oct 15 13:41:49 EDT 2001 | bschreiber
Hi Dale, I have copies of the articles of which Mike references. If you need copies for support, contact me at: bill@smartsonic.com. Rinsing should be done by ultrasonics also. Spray in atmosphere systems will not penetrate into the same tight ar
Electronics Forum | Tue Oct 16 09:17:29 EDT 2001 | andyc
Have you thought about wave solder contamination ? . We had a similar fault where glued chips were being shorted out due to "slivers" of solder dross being deposited onto the card . These dross slivers were being generated because the solder bath had
Electronics Forum | Sat Nov 03 05:19:59 EST 2001 | Ben
Hi I have question about thermocouple type use for Super M.O.L.E. I found in some article that type K T/C (Nickel-Chromium vs. Nickel-Aluminum) may suffer from temperature cycling hysteresis at above 250 degree C and also diffecult to solder. Now
Electronics Forum | Tue Nov 13 11:22:50 EST 2001 | fmonette
Dave, Hany, I was actually surprised to hear that topside SMT components can reach such a high temperature during wave soldering. If this is the case then the concern for component damage is very valid. This morning I discussed this issue with Jac
Electronics Forum | Tue Nov 13 19:58:28 EST 2001 | davef
No. I have never measured the temperature of the top of a BGA package during wave soldering. Mr. Kelly�s "actual body temperature" of 140-150�C during wave soldering is probably accurate [most of the time]. It�s the utility of this measurement tha
Electronics Forum | Fri Nov 09 16:57:27 EST 2001 | davef
Sure, it�s fine to use the proper amount of flux and no solder when reworking BGA. Recognize that these new solder connections have less metal and a lower standoff than similar BGA solder connections that have not been reworked. This undoubtedly
Electronics Forum | Tue Nov 20 12:48:40 EST 2001 | tony_sauve
We recently experienced a problem w/voids (up to 65%) in uBGA solder joints. The only joints that have the problem correlated to pads which had blind 0.006" via's in them. The via's only extend down 2 layers, of the 18. 21 BGA's on the PCB, only expe
Electronics Forum | Tue Nov 27 10:16:07 EST 2001 | davef
Oooo, I get it. We do that trick on the wave solder side of boards. On the bare board, during design / layout, the basic shape of the jumper is a 125 thou disc of copper [that of course is eventually covered with whatever solderability preservative
Electronics Forum | Fri Dec 07 10:56:24 EST 2001 | franciscoioc
HI, I exeperience this problem before and I tried diferent type of solder pastes.The one that help my process is a Kester solder R596L OA this is a water soluble paste that i am very sure is going to help you.You can get the technical data at http:/
Electronics Forum | Mon Jan 21 15:55:53 EST 2002 | Yannick
The point behind traces and vias on my test is that I don't only want to perform test on printing and placement but on reflow too, so a board with many components and no trace will not react like a board with traces on it. Unless you or someone else
