Electronics Forum | Wed Apr 27 11:43:32 EDT 2005 | patrickbruneel
Hi Daan, What we did in the time was pareto analyses on all board designs to determine the critical areas (mainly design errors) and only inspect those specific problem areas. Every batch had a copy of the PC board with problem areas marked and only
Electronics Forum | Mon Apr 25 11:24:31 EDT 2005 | Daan Terstegge
I have a question about inspection, touch-up, and how far you need to go to get a product that meets the required IPC-spec. According to some reports (i.e. "New Study Reveals Component Defect Levels" by Stig Oresjo of Agilent) the average defect leve
Electronics Forum | Wed Jul 01 11:48:30 EDT 2015 | sssvajunas
We use component BFU730LX and we have one problem. After reflow transistor base or collector lands are not soldered. Maybe someone have similar problems with this component? We tryed to change stencil pads (smaller , bigger) but problem is the same.
Electronics Forum | Fri Jul 24 16:42:03 EDT 2015 | cnotebaert
how are you verifying solder is the part not working electrically, are you x-raying?
Electronics Forum | Thu Dec 14 11:49:37 EST 2017 | barryg
When the board is populated on the second side, and after reflow, components are shifted, skewed with solder flowed on the leads of the components and not on the PCB land.
Electronics Forum | Wed Dec 13 13:11:06 EST 2017 | barryg
HI all. Recently we have been experiencing some PCB defects and so far it appears on a particular pcb. Components in areas, and the areas appears to be random, have shifted, skewed components. Most of these components, it appears the solder has flowe
Electronics Forum | Thu Dec 14 14:29:53 EST 2017 | barryg
We did check for oven clearance thinking the same , but there is plenty clearance. We have however found that the problem was on several lots of PCBs. We ran a fresh lot and problem went away. There appears to be some kind of contamination on the PCb
Electronics Forum | Wed Jul 02 19:06:21 EDT 2003 | Adrian Espinoza
Last week on my company we began a production for new model. Today we identify a possible non-conformance solder appareance. I have a picture for this defect to show the condition.
Electronics Forum | Wed Jul 02 21:40:44 EDT 2003 | davef
Email me your pix Here how one SMTnetter posted pix: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=6046&#Message24067
Electronics Forum | Thu Jul 23 16:49:04 EDT 1998 | Ted
I was wondering how successful industry has been in quantifying relationships between defects rates of particular solder problems (like bridging, opens,..) and PCA design parameters (like spacing, part orientation, pad dimensions, ...). For wave sol
