Electronics Forum: solder and dipping and profile (Page 1 of 13)

Ag-plated LED dipping - high level of Cu and Ag

Electronics Forum | Wed Aug 15 16:04:23 EDT 2001 | davef

First, responding to your question � Several things on copper dissolution in solder are: * A 50um copper wire will dissolve in 60Sn / 40Pb solder at: - 200�C solder in 55 seconds; - 250�C solder in 20 seconds; - 300�C solder in 5 seconds; - 350�C so

Ag-plated LED dipping - high level of Cu and Ag

Electronics Forum | Tue Aug 14 23:58:19 EDT 2001 | Glen Brian

We are using the new auto-dipping machine for LED solder dipping and dragging. The flux is water-soluble flux and the solder is 63/37 at 250 deg. C. Two weeks ago we exchanged the pot with new 63/37 solder. About a week, we found that the high level

Intermetallics and reflow profile

Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe

I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow

Re: Intermetallics and reflow profile

Electronics Forum | Wed May 03 20:24:22 EDT 2000 | Dave F

MF: I know of nothing that addresses your question directly. Let me suggest: * Technical types at your solder supplier should be able to help. * "Effect Of Intermetallic Compounds On The Thermal Fatigue Of Surface Mount Solder Joints" PL Tu, et a

No solder and solder bridge after Wave solder machine

Electronics Forum | Thu Nov 17 21:46:48 EST 2005 | C. Kolokoy

With DIP type components, a sub-par fluxing method (foaming a no-clean), and a chip wave where one is not needed are formulas for bridging and insufficient wetting. If you have SMD's on the wave solder side of the board greater than 0603, and no SOT

Altitude and solder voids

Electronics Forum | Thu Nov 01 10:57:34 EDT 2012 | kris1128

Has anyone heard whether the elevation of a plant can effect solder joint formation? One plant at sea level, one at 7,000 feet elevation... same equipment and profiles, big voiding defects at higher elevation. I did a search and found no similar post

Soldering robot and solder balls

Electronics Forum | Wed Jun 21 09:12:42 EDT 2017 | emeto

I would start with checking the flux amount and trace and the thermal profile(preheating is important) for this assembly. Then I would consider changing to another flux and run it again.

wave soldering and solder bridge

Electronics Forum | Mon Dec 17 13:58:54 EST 2007 | ck_the_flip

I made my own wave measuring device using KIC2000 system. KIC2000 has automatic wave detection, so now I have a profiler for both reflow ovens and wave solder. The delmat carrier only cost $500. A guy, Samir, from this forum gave me the idea, actu

wave soldering and solder bridge

Electronics Forum | Mon Dec 17 12:06:58 EST 2007 | pjc

5 Steps to Eliminate Bridges: 1. Establish (wave) Parallelism First and foremost, you must establish board-to-wave parallelism. This is the prerequisite to any wave solder process control. For an understanding of the power of this approach go to ht

Imm Silver and Voiding

Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman

Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s

  1 2 3 4 5 6 7 8 9 10 Next

solder and dipping and profile searches for Companies, Equipment, Machines, Suppliers & Information

Online IPC Training & Certification

MSD Dry Cabinets
Electronic Solutions R3

ARE HUMIDITY INDICATORS PART OF YOUR SUPPLY NETWORK? Register for the webinar!