Electronics Forum: solder and fill and in and pth (Page 1 of 1)

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 20:12:41 EST 2006 | davef

We don't have a gap between the lead and the pad after a SM joint is soldered. On our boards, this space is filled with the solder intended to attach the component to the board. How high do components sit above the surface of a board? Most people a

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 10:10:50 EST 2006 | M. Sanders

I'm sorry, Dave - I didn't make myself very clear. Yes, this space (not really a "gap") is filled with solid solder. For instance, if you place a gull-wing component in solder paste, after reflow, there will probably be a thin film of solidied solder

Lead-free and Leaded solder in the same reflow

Electronics Forum | Fri Feb 03 16:40:24 EST 2006 | Mike

At my last employer, we ran a number of tests to make a "Hybrid" profile work (same profile Joe lists) . It worked great for everything but BGAs. The problem (6 months ago) was using parts not rated for lead free reflow temps. As the market fills wit

How to Differentiate Class 3 and Class 2 products in terms of process

Electronics Forum | Sat Jan 10 09:04:47 EST 2015 | jandon

class 3 requires 100% barrel fill Class 3 requires 75% vertical fill of solder for component with less or more than 14 leads. Not 100% fill.

How to Differentiate Class 3 and Class 2 products in terms of process

Electronics Forum | Tue Dec 30 09:31:52 EST 2014 | rgduval

I've always approached it like this: Design your processes and perform your work to class three standards, and inspect to the standard that is acceptable. That is, all work should be performed to the highest degree of quality. When the work is ins

Step by step guide in evaluation of Solder Bar and Flux

Electronics Forum | Mon Dec 11 20:44:37 EST 2006 | davef

Title : LEAD-FREE WAVE SOLDER FLUX EVALUATION Author : Michael Havener Author Company : Benchmark Electronics, Inc Date : 09/25/2005 Conference : SMTA International Abstract : The European Union�s deadline to ban lead in electronic pr

What is the preffered spacing between PTH and SMT pads

Electronics Forum | Thu Apr 30 22:40:32 EDT 2009 | davef

Selective Wave Soldering DoE to Develop DfM Guidelines for Lead and Pb-Free Assemblies Written by Makram Boulos, Craig Hamilton, Mario Moreno, Ramon Mendez, German Soto and Jessica Herrera Circuits Assembly Magazine, 31 December 2008 19:00

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