Electronics Forum: solder and fillet and after and reflow (Page 1 of 6)

solder balls and flux

Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann

My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink

solder balls and flux

Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann

My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink

Re: solder balls and flux

Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F

Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is

Re: solder balls and flux

Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F

Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is

Re: solder balls and flux

Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow

Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect

Re: solder balls and flux

Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow

Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect

Lead-free and Leaded solder in the same reflow

Electronics Forum | Wed Feb 01 03:38:56 EST 2006 | Jose Luis

Hi all, I'm working in Military Production and then, We have an exception about RoHS (LEAD FREE), but, because we use "normal" components, in this moments, a lot of components have LEAD FREE terminations, and we think that after of 1st July, we wo'nt

Lead-free and Leaded solder in the same reflow

Electronics Forum | Fri Feb 03 16:40:24 EST 2006 | Mike

At my last employer, we ran a number of tests to make a "Hybrid" profile work (same profile Joe lists) . It worked great for everything but BGAs. The problem (6 months ago) was using parts not rated for lead free reflow temps. As the market fills wit

Evalution on solder paste and spray flux

Electronics Forum | Thu Jan 27 11:23:45 EST 2005 | russ

Well first off I wouldn't evaluate paste for a wave process. I would use solder bar instead. Flux - top side fillets and no shorting on the solder side, does it clean well after processing if using water soluble flux. How wide is the process win

kapton dots and liquid solder mask

Electronics Forum | Tue Aug 09 10:38:45 EDT 2005 | SuMoTe

Water soluable dots will wash off after reflow. A water soluable liquid mask will work as well. dots are better for defined (round)holes, whereas the liquid mask works well with odd shapes.

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