Electronics Forum | Thu Jan 31 19:49:34 EST 2008 | comatose
We manufacture products that are double sided SMT (double sided reflow) and then have through-hold connectors attached to several of the sides. Currently we solder the connectors by hand, which works fine but takes a lot of time. I'm tempted to get a
Electronics Forum | Fri Feb 01 11:02:51 EST 2008 | flipit
You could also try Wenesco and Air Vac. I have experience on the Air Vac PCBRM10 and PCBRM12. They work great. You have to make sure your nozzle or flow well is designed correctly. For 50 mil pitch and greater, they work well. If you have to rem
Electronics Forum | Fri Aug 03 09:19:17 EDT 2012 | john1961
If still interested you may want to review information on our GW-10-HT Solder Fountain System at http://www.ddmnovastar.com/wave-solder/solder-fountains/gw-10-ht-soldering-fountain Good luck with your search.
Electronics Forum | Fri Feb 04 15:44:54 EST 2011 | pjc
These are pretty low cost, press the Solder Fountain button: http://www.apsgold.com/wave-solder
Electronics Forum | Wed Mar 12 12:28:52 EDT 2008 | operator
I recently witnessed a process in which the solder pot operator used Techspray WSOL water soluble masking to cover the areas around a connector that was to be soldered on the solder pot. He did not wait for the WSOL to cure. He soldered immediately.
Electronics Forum | Wed Mar 12 16:20:51 EDT 2008 | hussman
Poor training. Don't blame the operator, he was either shown this or left to his own devices. Be the better man and provide him a better process. Regular old peelabale solder mask would be a start.
Electronics Forum | Fri Mar 14 11:18:29 EDT 2008 | operator
The way it works is the liquid solder immediatley cures (or should I say burns) the WSOL where ever it touches it. This hardens and keeps it in place and protects whatever is under it. Some of the WSOL falls of in the pot. I am suprised that the burn
Electronics Forum | Thu Nov 01 10:57:34 EDT 2012 | kris1128
Has anyone heard whether the elevation of a plant can effect solder joint formation? One plant at sea level, one at 7,000 feet elevation... same equipment and profiles, big voiding defects at higher elevation. I did a search and found no similar post
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
