Electronics Forum: solder and joint and strain (Page 1 of 16)

BGA crack and strain gauge measurement

Electronics Forum | Wed Nov 29 01:12:12 EST 2006 | callckq

Dear Davef, Thanks for your input...The crack happen at the pad/solder ball interface..Pls review the new thread that I post just now with title called "BGA BALL CRACK AT PAD/SOLDER BALL INTERFACE" Thanks!

BGA crack and strain gauge measurement

Electronics Forum | Mon Nov 27 08:05:50 EST 2006 | davef

There is no standard for a strain gage measurement of allowable deflection of a board or a fixture. It's possible that your fixture is causing the BGA cracking that you see. What protion of the BGA is cracking? If it is the solder connection, sear

qfp and soic joint Problem

Electronics Forum | Tue Apr 11 10:30:46 EDT 2000 | Jeremy Smith

I am having a problem with some joints on a 100 pin pqfp and few different soics on one particular board. When viewed a 8x with a "Mantis" inspection scope the joints look as though they wetted to the ic leg but when probed the leg will pop loose.

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 09:21:58 EST 2006 | Michael Sanders

Is anyone aware of any articles, white papers, etc., that discuss the gap between the lead and the pad after a SM joint is soldered? In particular, I am looking for a formula for that "gap" for various components.

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 20:12:41 EST 2006 | davef

We don't have a gap between the lead and the pad after a SM joint is soldered. On our boards, this space is filled with the solder intended to attach the component to the board. How high do components sit above the surface of a board? Most people a

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 09:37:39 EST 2006 | GS

Have you seen IPC-A-610 D ? regards GS

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 15:41:51 EST 2006 | realchunks

Try IPC-SM-782.

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 11:46:57 EST 2006 | slthomas

IPC 610 *C* states that the solder thickness requirement is a properly wetted termination is evident. Fillet height is another aspect and is usually specific to the package but is some function of solder thickness plus a percentage of lead height. D

"Gap" in completed solder joint between lead and pad

Electronics Forum | Thu Nov 30 16:14:33 EST 2006 | darby

Maybe ask your customer where they got this idea from? It is possible they may have even got this idea from some white paper or article where they are trying to explain something else and show drawings with no solder between the pad and lead. It may

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 20:30:22 EST 2006 | davef

Your customer is so poorly educated that you should decline their work, because this will not be the last time they waste your time with their cockamamey theories.

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