Electronics Forum: solder and paste and height and thickness and guidelines (Page 1 of 2)

Solder paste height and metal squeegees

Electronics Forum | Fri Apr 20 11:05:23 EDT 2001 | gcs

Just a bullet! My results are, .005" stencil thickness should measure between .0055" - .006" if your pressure is correct, metal blades and snap-off is set up correctly. Do you have aperture reductions at the QFP locations "typicial industry standard

Solder paste height and metal squeegees

Electronics Forum | Fri Apr 20 15:27:00 EDT 2001 | jimlew

We do some aperture reductions - but it's not the 10% i'm accustomed to. Looks like it should be more than we currently do (I think we do 10% of length, but no width). Don't think we have a slumping problem, and we're not doing snap-off, only contact

Solder paste height and metal squeegees

Electronics Forum | Fri Apr 20 08:41:56 EDT 2001 | jimlew

For those of you out there, like myself who are still using 2-d to measure paste ht, I have 2 questions. 1. Typically, what tolerance are you applying to your ht? +- 1 mil, or what? 2. Are you using metal squeegees, and if so, have you found that squ

Volume and average height of solder paste after printing machine

Electronics Forum | Thu Oct 02 12:22:26 EDT 2008 | JerryS

Hello Ok there is not much info here. What you have to mae sure of is several key factors. 1. Have you entered the correct stencil thickness. 2. Are you using the stencil gerber (not the paste layer) The paste layer is usually not adjusted for ap

SMT Processing and gasketing

Electronics Forum | Tue Nov 11 16:30:08 EST 2008 | naynayno

Occasionally solder mask thickness is believed to be the cause of gasketing challenges during paste printing. We currently specific IPC-SM-840 on our fab drawings but this provides no limits or guidelines on thickness. I do not want to cause an unr

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 15:10:50 EST 2006 | M. Sanders

Unfortunately, I don't have a copy of IPC-A-610 D on hand, however, I believe in IPC-610, this �floating height� between lead and pad has no maximum specification restriction. As long as there is no voiding, it is still acceptable for all 3 classes.

Reflow soldering problems and traces under component

Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz

Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen

Reflow soldering problems and traces under component

Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz

Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 06:53:05 EDT 2002 | CH

1) For solder short, pls check the paste height. Too much vol will cause short. For 15 mils use 5 mils thickness stencil if possible. Check profile preheat time to prevent hot slumpof the paste. 2) type 4 powder will be better for 15 mils pit

PLCC 44 and QFP 240 tilting problems

Electronics Forum | Tue Feb 20 18:04:53 EST 2007 | coop

I am not familiar with the YV100XG pick & place but you might want to increase the mount height of these components The double stick tape isn't as thick solder paste. it might be pushing the component too far down causing it to twist. I encountered

  1 2 Next

solder and paste and height and thickness and guidelines searches for Companies, Equipment, Machines, Suppliers & Information

SMTAI 2024 - SMTA International

High Precision Fluid Dispensers
Potting and Encapsulation Dispensing

High Throughput Reflow Oven
PCB Handling Machine with CE

World's Best Reflow Oven Customizable for Unique Applications