9 solder and paste and printing and area and on and exposed and pad results

Electronics Forum: solder and paste and printing and area and on and exposed and pad (Page 1 of 1)

Differences between screen and stencil printing

Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon

Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin

Hi, I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW

Hi, I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) Sec

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon

Hi, I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW

Hi, I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)

Solder Paste and fine pitch components

Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.

We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Tue Jun 09 15:46:29 EDT 1998 | Aric Parr

Hi there Gary, Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly

Re: Longer soak time and reflow time impact Solder on Au pad?

Electronics Forum | Fri Sep 08 04:45:17 EDT 2000 | PeterB

As per Travis's reply it could be something other than the reflow process. Another good one is if the printed PCB's have been cleaned down due to print misregistration etc.. If not properly controlled paste residues can remain distributed about the p

Solder climbs on the lead and touches the body of the component

Electronics Forum | Mon May 12 13:55:19 EDT 2014 | hegemon

It sounds like a bit too much solder on the PWB, caused by too large a pad for the lead it will contain. In that case solder reduction is the way to move forward. What are the options there? 1. New stencil or stencils - (not desirable) 2. Increas

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