Electronics Forum: solder and paste and type3

QFN's and LGA's

Electronics Forum | Tue May 26 15:39:16 EDT 2009 | mikesewell

Amkor's MLF guidelines are very similar to Actels. 1 to 1 on the stencil to part pad on the I/O pads, 75% with a grid windowpane, 0.125 mm/5 mil stencil. For example, the Actel area ratio for a 0.3 mm sq. pad and 0.125 mm stencil is 0.6 which seems

SMT Solder paste and wave flux evaluation

Electronics Forum | Fri Jan 28 12:18:32 EST 2005 | Chunks

Your best bet is to do a decision making matrix. Each company has so many different criteria�s it's hard to pick out which one might be important to yours. Simply pick out your top 5 paste manufactures. Next decide what your "Eliminators" are - th

SPI and AOI Machine Feaures.

Electronics Forum | Wed Feb 10 05:23:17 EST 2021 | karl_willoughby

Hello. I am sourcing machines for an SMT line (for the first time) and would like to understand features of current and earlier model SPI and AOI machines. In the intended application, a high volume of PCAs aren't required to be processed but there

Solder Paste and fine pitch components

Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.

We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Sun Sep 07 20:51:52 EDT 2014 | natashakt

1. Is the high RH environment consistently at 72% RH and 21.4 degrees Celsius? No, over the past 2 weeks I have recorded the highest at the moment: 67% RH at 22.6 degrees C and lowest (it is Spring not summer yet): 31.9% RH at 19.0 degrees C. Or d

Selecting pick and place machine (comparison/personal experience/sales pitches)

Electronics Forum | Fri Apr 30 10:42:40 EDT 2021 | oxygensmd

I have a customer who ask close to prototyping jobs with low volume and high-mix components. A regular job have around 5-30 pieces board but have high quantity and many type of components. All the time over 1000 pieces of parts on board from 250-350

Re: Adhesive Dispenser Vs. Screen Printing Adhesives Pros and Cons

Electronics Forum | Thu Oct 12 22:16:59 EDT 2000 | Dreamsniper

Hi Guys, I'd like to share this to all of you...you can start playing with the rests...Stated prices, if not indicated, are in Aussie $ or Singapore $. Stencil Printing Adhesive Pros a) Less Capital Equipment Cost (Short Term). In reality it is f

Possibility of a cheaper pick and place machine design?

Electronics Forum | Thu Sep 11 10:01:30 EDT 2014 | spoiltforchoice

1 - Too messy, parts already come in nice easy to use machine compatible packaging, tapes, reels, tubes and trays. All you are doing is adding an extra step and complication. A key production aim is to reduce the number of steps. 2 - BGA - a chip wi

Possibility of a cheaper pick and place machine design?

Electronics Forum | Wed Sep 10 23:06:36 EDT 2014 | andrespena

Sorry 10 days passed before I replied. This happened and that happened and I completely forgot about this forum. But here's my explanation: 1. How to get parts on the board? This is a very good point, and I totally understand why you believe I hav

Re: Cleaning under, around, and through tight spaces

Electronics Forum | Wed Jan 06 04:51:16 EST 1999 | Earl Moon

| | A question for you all! | | | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | | | My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clea

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