Electronics Forum: solder and paste and type3

QFN's and LGA's

Electronics Forum | Tue May 26 15:39:16 EDT 2009 | mikesewell

Amkor's MLF guidelines are very similar to Actels. 1 to 1 on the stencil to part pad on the I/O pads, 75% with a grid windowpane, 0.125 mm/5 mil stencil. For example, the Actel area ratio for a 0.3 mm sq. pad and 0.125 mm stencil is 0.6 which seems

SMT Solder paste and wave flux evaluation

Electronics Forum | Fri Jan 28 12:18:32 EST 2005 | Chunks

Your best bet is to do a decision making matrix. Each company has so many different criteria�s it's hard to pick out which one might be important to yours. Simply pick out your top 5 paste manufactures. Next decide what your "Eliminators" are - th

Solder Paste and fine pitch components

Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.

We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Sun Sep 07 20:51:52 EDT 2014 | natashakt

1. Is the high RH environment consistently at 72% RH and 21.4 degrees Celsius? No, over the past 2 weeks I have recorded the highest at the moment: 67% RH at 22.6 degrees C and lowest (it is Spring not summer yet): 31.9% RH at 19.0 degrees C. Or d

Re: Adhesive Dispenser Vs. Screen Printing Adhesives Pros and Cons

Electronics Forum | Thu Oct 12 22:16:59 EDT 2000 | Dreamsniper

Hi Guys, I'd like to share this to all of you...you can start playing with the rests...Stated prices, if not indicated, are in Aussie $ or Singapore $. Stencil Printing Adhesive Pros a) Less Capital Equipment Cost (Short Term). In reality it is f

Possibility of a cheaper pick and place machine design?

Electronics Forum | Thu Sep 11 10:01:30 EDT 2014 | spoiltforchoice

1 - Too messy, parts already come in nice easy to use machine compatible packaging, tapes, reels, tubes and trays. All you are doing is adding an extra step and complication. A key production aim is to reduce the number of steps. 2 - BGA - a chip wi

Possibility of a cheaper pick and place machine design?

Electronics Forum | Wed Sep 10 23:06:36 EDT 2014 | andrespena

Sorry 10 days passed before I replied. This happened and that happened and I completely forgot about this forum. But here's my explanation: 1. How to get parts on the board? This is a very good point, and I totally understand why you believe I hav

Re: Cleaning under, around, and through tight spaces

Electronics Forum | Wed Jan 06 04:51:16 EST 1999 | Earl Moon

A question for you all! Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clea

Re: Cleaning under, around, and through tight spaces

Electronics Forum | Tue Oct 12 17:40:01 EDT 1999 | Brian W.

A question for you all! Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. My question concerns cleaning under, through, and around tight spaces. Way back when, we coul

Reflow Temperatures and speed for a 7 zone top/bot for conceptro

Electronics Forum | Thu Jun 26 04:34:49 EDT 2003 | emeto

Hi James, I saw very good posts here.Now I will give you one more practical way: 1. My advice is to encrease the temperature(like your first sidgestion). Termostress is important thing so your first zone should be 120-150C. 2. The paste profile. If

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