Electronics Forum | Wed Mar 12 12:28:52 EDT 2008 | operator
I recently witnessed a process in which the solder pot operator used Techspray WSOL water soluble masking to cover the areas around a connector that was to be soldered on the solder pot. He did not wait for the WSOL to cure. He soldered immediately.
Electronics Forum | Fri Mar 14 11:18:29 EDT 2008 | operator
The way it works is the liquid solder immediatley cures (or should I say burns) the WSOL where ever it touches it. This hardens and keeps it in place and protects whatever is under it. Some of the WSOL falls of in the pot. I am suprised that the burn
Electronics Forum | Thu Mar 13 09:43:13 EDT 2008 | jseagle
If the mask is not cured and is coming off in the pot I don't see how it is protecting anything. If you want to mask something fast you need to use tape not liquid mask that requires cure. My $.02.
Electronics Forum | Wed Mar 12 16:20:51 EDT 2008 | hussman
Poor training. Don't blame the operator, he was either shown this or left to his own devices. Be the better man and provide him a better process. Regular old peelabale solder mask would be a start.
Electronics Forum | Wed Mar 12 16:30:45 EDT 2008 | operator
I witnessed this at our sister company. It seems to be their standard process. It is not my place to interfere with their processes. I was just curious if there was any chance of brittle solder joints or other defects that might be caused from the WS
Electronics Forum | Thu Nov 17 13:13:49 EST 2005 | Mike
Hello, Some questions.... Are you running lead free? What alloy? What�s your pot temp at? Temp of the board after preheat? Are you getting any solder in the barrels (
Electronics Forum | Thu Nov 17 20:51:16 EST 2005 | cangly
Morning Mike, We use Pb63/Sn37, Alpha Metal alloy. Solder pot is at 250 C. The profile of board after Preheat about 100 C, Lambda Wave about 220C (use both Lambda and Chip wave), DWell time 2.1s ~ 3s. Conveyor speed 1.5 in/min. We run by bare board a
Electronics Forum | Tue Dec 03 11:59:01 EST 2002 | slthomas
We haven't run a profile yet....probably because we're a-feared to. We can't do topside preheating here to any degree because we use an aluminum plate for aligning hundreds of top side through-hole components (pots, switches, buttons, LEDs) that te
Electronics Forum | Thu Oct 02 12:22:26 EDT 2008 | JerryS
Hello Ok there is not much info here. What you have to mae sure of is several key factors. 1. Have you entered the correct stencil thickness. 2. Are you using the stencil gerber (not the paste layer) The paste layer is usually not adjusted for ap
Electronics Forum | Thu Mar 10 10:06:08 EST 2005 | steve
OK all you Gurus here's one for ya. Customer is tinning wires with standard eutectic solder in a solder pot. There is a blue tint to the solder in the pot. After tinning with OA flux, which I will change to NC shortly, he has clear teflon insulation