Electronics Forum: solder and pot and volume (Page 1 of 10)

WSOL and solder pot

Electronics Forum | Wed Mar 12 12:28:52 EDT 2008 | operator

I recently witnessed a process in which the solder pot operator used Techspray WSOL water soluble masking to cover the areas around a connector that was to be soldered on the solder pot. He did not wait for the WSOL to cure. He soldered immediately.

WSOL and solder pot

Electronics Forum | Fri Mar 14 11:18:29 EDT 2008 | operator

The way it works is the liquid solder immediatley cures (or should I say burns) the WSOL where ever it touches it. This hardens and keeps it in place and protects whatever is under it. Some of the WSOL falls of in the pot. I am suprised that the burn

WSOL and solder pot

Electronics Forum | Thu Mar 13 09:43:13 EDT 2008 | jseagle

If the mask is not cured and is coming off in the pot I don't see how it is protecting anything. If you want to mask something fast you need to use tape not liquid mask that requires cure. My $.02.

WSOL and solder pot

Electronics Forum | Wed Mar 12 16:20:51 EDT 2008 | hussman

Poor training. Don't blame the operator, he was either shown this or left to his own devices. Be the better man and provide him a better process. Regular old peelabale solder mask would be a start.

WSOL and solder pot

Electronics Forum | Wed Mar 12 16:30:45 EDT 2008 | operator

I witnessed this at our sister company. It seems to be their standard process. It is not my place to interfere with their processes. I was just curious if there was any chance of brittle solder joints or other defects that might be caused from the WS

Component pad design and volume requirements

Electronics Forum | Tue Feb 15 14:35:41 EST 2000 | Balas

hi I am designing a test vehicle with a range of components on it(pbga, cbga,fc, mbga, and qfps). My concern is that I would like to use a single stencil for solder deposition and not a stepped stencil. That would require me to have aperture design a

Dima's Pick and Place Machines and other low volume P&P

Electronics Forum | Thu Apr 26 12:06:08 EDT 2007 | basem

$100K for this entire line. We are thinking of getting a Chinese made reflow oven that looks pretty good at $25K. Also, we need to deposit solder using a dispenser as stencil printing will be reserved only for higher volume boards. It will not be pra

Re: paste release from stencil, and volume calculation

Electronics Forum | Mon Nov 15 12:09:55 EST 1999 | Dave F

Steve: Continuing with Dan�s thinking, generally, "poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment: Stencil is too thick. Specifically, your 0.006 should be OK, providing you don�

The specification of Paste deposition thickness and volume

Electronics Forum | Fri Sep 21 01:31:13 EDT 2001 | Stoney Tsai

Guys, If there are any specifications or ciriterions for solder paste deposition thickness and volume evaluation. For example, QFP (0.5 mm pitch), 6~8 mils, 3000 mil^3 PLCC: 8~10 mils, ... . . Thanks in advance. Best Regards,

Re: paste release from stencil, and volume calculation

Electronics Forum | Sat Nov 13 14:09:45 EST 1999 | se

First, let me say what I always say: a good chem-etched stencil will print fine pitch. Chem-etch brings trap to the side walls because its a physical by-product of the process. Because they are less expensive you can add electropolish and still save

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