Electronics Forum | Tue Nov 22 17:08:03 EST 2011 | mikenagle
I am looking for process suggestions. We want to use a pin transfer system to deposit adhesive to hold bottom side SMD's in place. We will place SMD's and through hole power parts on the top side and then run through a wave solder machine. Are ther
Electronics Forum | Wed Nov 23 07:30:44 EST 2011 | scottp
Are you stuck with pin transfer for some reason? Screen printing is more repeatable and easier to maintain.
Electronics Forum | Wed Nov 23 07:38:49 EST 2011 | davef
We agree with the points made by ScottE above. Additionally, most printers are not heavily loaded. So, you wouldn't have to buy another machine, give-up floor space, purchase and store peculiar tooling, etc. We think Darby does pin transfer. Maybe h
Electronics Forum | Wed Nov 23 09:38:52 EST 2011 | blnorman
More agreement with screen print adhesives. Back in a former life time we did do pin transfer on one of our product lines. If you had to go with pins, make sure your adhesive rheology is suited for it. Different adhesives are designed for specific
Electronics Forum | Wed May 27 14:35:52 EDT 1998 | Justin Medernach
| | R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recomm
Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys
| R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen
Electronics Forum | Wed May 27 10:19:43 EDT 1998 | Jerry
We have no problems but orientation does matter. Orient with longest side of component body perpendicuar to wave. In other words the same preference as with through hole DIPS. Idea is the same as for through hole, that the surface tension will ten
Electronics Forum | Wed Aug 11 13:44:40 EDT 1999 | Paul Wareham
We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or o
Electronics Forum | Fri Aug 13 07:18:19 EDT 1999 | Brian Conner
| We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or
Electronics Forum | Thu Jul 20 12:51:50 EDT 2000 | Tekguy2000
We are currently running boards with resistor paks on the solder side of the board introducing these to the wave solder. We cannot get rid of shorting between the leads. We are using a water soluble acohol based flux. The option of going to selective
