Electronics Forum | Mon Aug 03 13:51:41 EDT 1998 | Ted Nicholas
I am looking for some design guidelines (length, width, spacing) for solder thieves which are placed behind trailing pins of wave soldered SOICs. I'd appreciate it if some one could direct me to the appropropriate reference. Also, has any one perform
Electronics Forum | Tue Aug 04 12:32:13 EDT 1998 | Bob Willis
The design rules for solder thiefs are that the extra pads must be bigger than the proceeding pads to be worth while as a minimum guide the pad is 3x the size of the proceeding pad so if the pad is 0.030" the thief would be 0.090" wide. As steve has
Electronics Forum | Tue Aug 04 10:44:41 EDT 1998 | Chrys
| | I am looking for some design guidelines (length, width, spacing) for solder thieves which are placed behind trailing pins of wave soldered SOICs. I'd appreciate it if some one could direct me to the appropropriate reference. | Also, has any one
Electronics Forum | Tue Aug 04 12:15:33 EDT 1998 | Steve Gregory
| | | | I am looking for some design guidelines (length, width, spacing) for solder thieves which are placed behind trailing pins of wave soldered SOICs. I'd appreciate it if some one could direct me to the appropropriate reference. | | Also, has an
Electronics Forum | Fri May 07 05:47:44 EDT 1999 | Charles Stringer
This is not strictly a surface mount query but any input welcome I am thinking of using surface mount solder thief pads for a through hole connector. The connector is two rows of 0.1" pitch pins and on waving there is often a bridge on the last two p
Electronics Forum | Fri May 07 15:37:22 EDT 1999 | JohnW
| This is not strictly a surface mount query but any input welcome | I am thinking of using surface mount solder thief pads for a through hole connector. The connector is two rows of 0.1" pitch pins and on waving there is often a bridge on the last t
Electronics Forum | Wed Mar 12 12:28:52 EDT 2008 | operator
I recently witnessed a process in which the solder pot operator used Techspray WSOL water soluble masking to cover the areas around a connector that was to be soldered on the solder pot. He did not wait for the WSOL to cure. He soldered immediately.
Electronics Forum | Wed Mar 12 16:20:51 EDT 2008 | hussman
Poor training. Don't blame the operator, he was either shown this or left to his own devices. Be the better man and provide him a better process. Regular old peelabale solder mask would be a start.
Electronics Forum | Fri Mar 14 11:18:29 EDT 2008 | operator
The way it works is the liquid solder immediatley cures (or should I say burns) the WSOL where ever it touches it. This hardens and keeps it in place and protects whatever is under it. Some of the WSOL falls of in the pot. I am suprised that the burn
Electronics Forum | Thu Nov 01 10:57:34 EDT 2012 | kris1128
Has anyone heard whether the elevation of a plant can effect solder joint formation? One plant at sea level, one at 7,000 feet elevation... same equipment and profiles, big voiding defects at higher elevation. I did a search and found no similar post
