Electronics Forum: solder and wetting and au (Page 1 of 8)

Re: solder balls and flux

Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F

Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is

Re: solder balls and flux

Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F

Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is

No solder and solder bridge after Wave solder machine

Electronics Forum | Thu Nov 17 21:46:48 EST 2005 | C. Kolokoy

With DIP type components, a sub-par fluxing method (foaming a no-clean), and a chip wave where one is not needed are formulas for bridging and insufficient wetting. If you have SMD's on the wave solder side of the board greater than 0603, and no SOT

OSP finish and Omnix 5002 solder paste(SnPb)

Electronics Forum | Sat May 15 11:27:26 EDT 2010 | davef

We'd expect both OSP poor wetting and improper reflow recipe to show-up in more places than just this one component. But if those are the only choices, we'll go for 'wrong solder paste.' Ooops, that's not one of the choices. Ok, OK, we'll take poo

solderability and hasl thickness

Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef

Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder

black and grey pad

Electronics Forum | Sat Oct 06 05:33:47 EDT 2001 | spchua

I had recently encounter the "black and grey" pads problems for the BGA pad after the convection re-flow. The pads shows in in "black and grey" color and a litter solder in it, and it happen in ramdom, when applied heat and solder on the "black and g

Gold and Palladium Plating

Electronics Forum | Fri May 17 10:53:15 EDT 2013 | davef

ENEPIG or Imm Pd? Concerns about palladium as a solderability protection are: * Palladium is more difficult to process in fab than gold * Palladium solder alloys can be brittle, similar to gold, without proper soldering process and/or specification/

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 11:46:57 EST 2006 | slthomas

IPC 610 *C* states that the solder thickness requirement is a properly wetted termination is evident. Fillet height is another aspect and is usually specific to the package but is some function of solder thickness plus a percentage of lead height. D

RoHS and stencils

Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane

i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red

RNETs and Lead Free

Electronics Forum | Wed May 07 15:36:04 EDT 2008 | llaerum

The 483 is what we use on all boards except on one where the 353 improved wetting on resistor packs. It worked much better since the parts are LF and this is the same flux AIM uses in their LF solder. Yes, it was recommended by AIM when we discussed

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