Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Thu Aug 24 14:42:30 EDT 2006 | any
y we had solder ball after reflow owen?
Electronics Forum | Tue Jun 04 10:39:45 EDT 2002 | jasonfang
Does anyone knows root cause of solderball after reflow? Thanks
Electronics Forum | Tue Jun 04 10:39:54 EDT 2002 | jasonfang
Does anyone knows root cause of solderball after reflow? Thanks
Electronics Forum | Wed Jan 01 22:19:33 EST 2020 | sssamw
Solder ball attached on solder joint without violation minimum electrical clearance is acceptable. If your process parameter including stencil not changed, suggest you check if solder pasted being pushed out after IC placement, also check if solder j
Electronics Forum | Sun Feb 06 12:04:06 EST 2005 | ddhanashekar
can some one give me some suggestion to solve the problem. we are using cooksun/alphametal rma9086 paste for our screenprinting. after the reflow we see lot of solder ball on the board. we have maintained the exact profile given by the manufacurer. w
Electronics Forum | Sat Mar 16 11:06:48 EST 2002 | Lau
Hi, I am searching a method of reflow process for less / nothing solder ball defect. Thank Lau
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Thu Jul 05 21:07:09 EDT 2012 | davef
Probably they had a problem with a certain product, tried baking, the problem went away and ever since there stuck with this money loosing process. So, ... * Write up a plan to split a couple of batches, bake a portion of each batch, don't bake the o
Electronics Forum | Thu Jul 12 11:56:20 EDT 2012 | hegemon
You might try to complete all your soldering within a 72 hour or less time frame. For all intents treat your board like a moisture sensitive component after you have baked and completed SMT reflow. Wash, blow dry, and go direct to stuffing and com
