Electronics Forum: solder bridging at qfn (Page 1 of 2)

BGA Warping at the corners

Electronics Forum | Mon Jun 17 09:52:33 EDT 2013 | sara_pcb

My circuit board contains 11 x 11 matrix 1mm pitch BGA, The device was tested in socket on evaluation Board. We handed over the actual PCB & devices for re-flow. The assembly house first re-flowed all the SMT components other than BGA. BGA was placed

Glue PCBA No solder & Bridging issue at Wave soldering Process

Electronics Forum | Wed May 11 09:07:46 EDT 2016 | SN

We are facing SMT components No solder and solder bridging issue (Glue PCBA) at wave soldering process. Fine tuned the wave parameters improved but not able to eliminate the issue. Suspecting because of moisture pad and component leads contaminated d

Glue PCBA No solder & Bridging issue at Wave soldering Process

Electronics Forum | Fri Sep 09 06:10:03 EDT 2016 | jswatt

the time between SMT & wave should be as short as possible but at a max it is controlled by strictest MSD part, so if you have a part with only a 48hr MSL window then it needs to be with the 48hrs. Can you post images of what you are getting? It may

Flux residue cause high false reject at ICT

Electronics Forum | Thu Nov 30 19:55:30 EST 2006 | greg york

This may be worth checking out are you sure it is flux residue and not undercured plasicizers coming from solder resists due to the higher Lead Free temperatures killing the undercured resist, this causes many no faults found and bridging, solderball

AOI systems

Electronics Forum | Thu Feb 11 06:50:17 EST 2010 | CL

Good Morning Bryan, We are using Mirtec MV-3 AOI's with 4 megapixle cameras. We use them for 100% post reflow. We are checking, presence, polarity, value, solder, bridging,component height for BGA, QFN etc... and 1st piece validation for machine set

Placement of 32 pin QFN w/t ground pad

Electronics Forum | Thu Oct 15 11:04:28 EDT 2009 | spitkis2

Thanks Jim. Pressing the QFN into paste was what I thought of, just wasn't sure if it would cause solder paste to be pressed outside the pad area and possibly bridge with an adjacent pad. Do you recall the ratio of paste coverage to the pad area?

QFN84 Solder Printing Issue (QFN with Inner LGA Pad)

Electronics Forum | Mon Nov 13 09:40:01 EST 2017 | philc

Just a few thoughts, as we use similar quite frequently without issues. Ensure correct support when pasting the board, especially if it is thin. Correct support when placing the part. Is it placed correctly by the machine? If it is very slightly of

QFN84 Solder Printing Issue (QFN with Inner LGA Pad)

Electronics Forum | Fri Nov 10 22:31:27 EST 2017 | myke03o

Hi, we are experiencing insufficient solder and bridging solder. Any recommendation on the inner pad (LGA) and stencil thickness. Any suggestion will be very helpful. link: http://www.latticesemi.com/~/media/LatticeSemi/Documents/ApplicationNotes/

Placement Force

Electronics Forum | Fri Feb 08 16:21:15 EST 2013 | spitkis2

Are you doing this to minimize solder paste splattering? Is this a value that you use for all QFN's (would the overall size of a QFN matter)? I was told reducing placement force with these components is recommended so just was wondering what is bein

How important NSMD pads are for the QFN and similar packages?

Electronics Forum | Wed Aug 27 15:50:11 EDT 2014 | smtdoug

If at all possible, you definately want solder mask defined pads. Without it, you will struggle with solder bridging. This is especially important if you have a larger size board.

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