Electronics Forum | Sun Oct 11 13:53:26 EDT 1998 | Vincenzo Longobardo
I have datas to substain that a not wetting PCB ( the HAL oxided or not uniform in thickness )if soldered in reflow, it shows voids with X-Ray inspection.The voids are in side all the joints not only on the solder pads levell. Is there a technical d
Electronics Forum | Mon Oct 12 08:07:45 EDT 1998 | Earl Moon
| I have datas to substain that a not wetting PCB ( the HAL oxided or not uniform in thickness )if soldered in reflow, it shows voids with X-Ray inspection.The voids are in side all the joints not only on the solder pads levell. | | Is there a techn
Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake
I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th
Electronics Forum | Wed Jul 03 15:40:17 EDT 2013 | davef
Shear tests are [in my opinion] senseless. The shear stress you measure depends more on the shear rate and on the point where the force is applied than on the grain structure. When shearing a component, you not only apply shear stress, but also roll
Electronics Forum | Wed Aug 16 12:07:55 EDT 2017 | ks0707
Reflow -> Wash ? And is there any difference among Leaded / Lead-Free, Water-soluble / No-clean and One-side / Top&Bottom ? If there are any correlations with Wash-process, please send me those information too. Also, if I can get same information f
Electronics Forum | Sat Aug 21 02:08:00 EDT 2010 | isd_jwendell
I have noticed that the % metal content in the paste can also be directly correlated to solder balls (less metal, more balls). However, I also found differences between pastes from different manufacturers and the number of solder balls (identical boa
Electronics Forum | Thu Mar 22 03:26:42 EST 2001 | moseschee
Hi Dave, Thank you for your reply.It means a lot to me. By the way, is it possible to have the analysed data on the study you mentioned regarding the solderability "conditioning " ? Can we establish the correlation of solder shelf life based on y
Electronics Forum | Thu Jan 20 14:28:49 EST 2000 | Scott S. Snider
I ran this test back in '92 or '93 when Alpha was first pushing to change from Brookfield to Malcolm readings. The correlation between Malcolm readings to solder paste height is good. I could always look at the viscosity reading and know at least a d
Electronics Forum | Tue Mar 20 09:03:18 EST 2001 | moseschee
Hi, I'm looking for research/study done on solder shelf life by using accelerated aging process ( steam age or dry air oven bake at 150C & etc ) Perhaps you could help to advise correlation of all this acceleration test to actual solder shelf life
Electronics Forum | Fri Nov 23 16:32:05 EST 2007 | davef
There a several things you can do to prevent the solder wicking down the hole with the current design, and that's where you should focus. Cost goes up as you go down the list, but in neither case do you need to respin the board, have solder starvatio