Electronics Forum | Wed Jul 02 19:06:21 EDT 2003 | Adrian Espinoza
Last week on my company we began a production for new model. Today we identify a possible non-conformance solder appareance. I have a picture for this defect to show the condition.
Electronics Forum | Thu Jul 23 16:49:04 EDT 1998 | Ted
I was wondering how successful industry has been in quantifying relationships between defects rates of particular solder problems (like bridging, opens,..) and PCA design parameters (like spacing, part orientation, pad dimensions, ...). For wave sol
Electronics Forum | Wed Jul 02 21:40:44 EDT 2003 | davef
Email me your pix Here how one SMTnetter posted pix: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=6046&#Message24067
Electronics Forum | Tue Aug 24 15:11:32 EDT 2010 | sjohnson
We are experiencing a high incidence of what we call "black barrel" (to differentiate from black pad) with multiple contract manufacturers and PCB vendors. The PCBs are ENIG and during wave solder (SACX-0307) multiple thru-hole components are seeing
Electronics Forum | Wed Mar 23 05:17:23 EDT 2011 | arwankhoiruddin
Hi All. I want to know what is the IPC/JEDEC standard for solder paste printing defects. From the brochures of SPI Machines, the recognized defects are excessive, insufficient, misalignment, no solder, bridging, and solder shape error. What document
Electronics Forum | Fri Mar 25 14:33:26 EDT 2011 | davef
IPC-7525 Stencil Design Guidelines
Electronics Forum | Fri Mar 25 06:03:40 EDT 2011 | arwankhoiruddin
Thank you for the reply, Davef. I am thinking if I can get the standard rather than "trial and error". If there is no such standard, is there any experience of what is the range for good and acceptable solder paste (e.g. minimum and maximum percenta
Electronics Forum | Wed Mar 23 11:08:36 EDT 2011 | davef
There is no such standard, nor should there be. The important thing is to make good solder connections. That's IPC standardization focus, defining good results of manufacturing process. The approach that you take in developing the process of making g
Electronics Forum | Wed Jul 01 11:48:30 EDT 2015 | sssvajunas
We use component BFU730LX and we have one problem. After reflow transistor base or collector lands are not soldered. Maybe someone have similar problems with this component? We tryed to change stencil pads (smaller , bigger) but problem is the same.
Electronics Forum | Fri Jul 24 16:42:03 EDT 2015 | cnotebaert
how are you verifying solder is the part not working electrically, are you x-raying?
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