Electronics Forum: solder joint crack (Page 1 of 317)

solder joint crack in post thermal cycling test at Dye & Pry

Electronics Forum | Tue Apr 13 08:21:05 EDT 2010 | esca

Hi manchella, After ATC test, two different failure modes can be present: solder FATIGUE (into bulk) or BRITTLE INTERMETALLIC fracture. So, first you have to verify this. Moreover, which brand of SMT paste have you used ? The crack into solder joint

solder joint crack in post thermal cycling test at Dye & Pry

Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella

When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so

Solder joint crack

Electronics Forum | Fri May 31 05:54:09 EDT 2019 | dhanish

What are the common cause for solder joint crack after the pcba go through Temperature cycling test ?We have seen failure on solder joint for the memory part.

Solder joint crack

Electronics Forum | Tue Jun 25 09:45:39 EDT 2019 | edhare

See also ... https://www.semlab.com/solder-joint-failure-modes/

Solder joint crack

Electronics Forum | Sat Jun 01 04:22:24 EDT 2019 | gregoryyork

Depends on lead free alloy choice as well

Solder joint crack

Electronics Forum | Fri May 31 10:15:30 EDT 2019 | davef

Major sources of crack in the solder connection after thermal cycling are: * Thermal heating caused by differences in thermal expansion between the board and the component * Lead-free solder is more rigid and brittle than eutectic solder in simila

Solder joint crack

Electronics Forum | Mon Jun 24 23:21:27 EDT 2019 | sssamw

You may need tell us the background, how PCBA being tested, the test setting and spec. Solder crack maybe due to CTE mismatch or mechanical strain.

Solder joint crack

Electronics Forum | Fri May 31 23:48:14 EDT 2019 | dhanish

Thanks Dave..My customer proposing to reduce the solder volume.Can the TCT be improved by reducing the stand-off height?

Solder joint crack

Electronics Forum | Sat Jun 01 07:22:40 EDT 2019 | edhare

Just the opposite, reducing the standoff increases the shear strain range in temperature cycling, which lowers the number of cycles to failure.

Solder joint crack

Electronics Forum | Mon Jun 03 13:01:59 EDT 2019 | slthomas

Is there any chance that the boards were mechanically stressed (for instance, installed in a fixture) before, during, or after the testing? I'm just looking for other possible root causes.

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