Electronics Forum: solder joint defect tryps (Page 1 of 31)

Insufficient solder joint

Electronics Forum | Tue Dec 14 10:36:42 EST 1999 | Paul Peterson

I recently encountered reflow soldering defects on a pair diode package, the smd pad had a green contamination, I'm convinced that this is not oxidation. The no-solder condition appears to be caused by a sloppy soldermask process, although over the y

Tombstone defect

Electronics Forum | Fri May 16 15:45:00 EDT 2003 | swagner

If the only difference between the two products is the board supplier I believe thats where I would start, we had a similar problem like this two months ago and it turned out to be a faulty (thin) HASL layer which did not meet our print tolerance. T

bulbous joint

Electronics Forum | Thu Feb 19 18:07:57 EST 2004 | davef

We're inclined to buy Russ's stuff about peel from the wave. Look here, but shield your eyes first: [ http://www.thepdfshop.co.uk/ppm/defects/Wave/asp/50.asp ] [A respectful bow to BW for the pix] Could you tell us more about: * Board direction thro

Cost of solder joint rework

Electronics Forum | Thu Jun 01 21:59:10 EDT 2000 | Ray Chartrand

Does anyone know the current cost to repair a defective solder joint? I seem to recall a number quoted a few years ago of $1.03 per joint with burden of overhead. I've also seen numbers from 50 cents to 50 dollars per joint.

Post reflow solder joint inspection

Electronics Forum | Tue Feb 03 06:52:45 EST 2004 | paul_bmc

About 2 years ago our company tried to go with a post reflow AOI inspection. This AOI was suppose to be able to inspect to a level class 3 product. **It is impossible** You cannot inspect for a heel fillet and inspecting for poor wetting is a very

LED lifted soldering defect

Electronics Forum | Thu Dec 19 14:00:24 EST 2019 | kylehunter

True, but with rosin it should protect the joints pretty well right?

Black pad defect

Electronics Forum | Wed Mar 19 19:02:39 EST 2003 | Jodi Roepsch

From my experience, we have had little success in reworking boards with the black pad condition. In one instance, with several reworks, we were able to get plated through holes with the defect to take solder but the joint reliability was highly ques

Re: Voids in micro-BGA solder joint

Electronics Forum | Thu Feb 19 12:56:29 EST 1998 | Earl Moon

I'd like someone gives me a tip for elemating of voids in the mico BGA solder joint and the method of inspection of them, very exactly. Voids in excess of 20% by each solder ball volume is cause for rejection. Causes are improperly managed proc

No-Lead solder defect - No solder on pads

Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel

I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa

Solder joint criteria

Electronics Forum | Sat May 27 08:58:07 EDT 2000 | Thanas

Hi, I'm new in SMT & confusing to define the soldering defect criteria of cold solder, dry joint & dewetting. & what's the root cause for them ? FYI, I had read the IPC-A-610 rev. B , but doesn't help much. Any advise is very much appreciate. Thanks

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