Electronics Forum: solder joint strain (Page 1 of 297)

PCB & Ceramic Cap strain - Specification?

Electronics Forum | Mon May 10 15:02:37 EDT 2004 | davef

There's no such specification. Not should there be. Shear tests [in our opinion] are senseless, because: * Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the way the test is done. * She

Solder joint crack

Electronics Forum | Mon Jun 24 23:21:27 EDT 2019 | sssamw

You may need tell us the background, how PCBA being tested, the test setting and spec. Solder crack maybe due to CTE mismatch or mechanical strain.

Solder joint crack

Electronics Forum | Sat Jun 01 07:22:40 EDT 2019 | edhare

Just the opposite, reducing the standoff increases the shear strain range in temperature cycling, which lowers the number of cycles to failure.

BGA crack and strain gauge measurement

Electronics Forum | Wed Nov 29 01:12:12 EST 2006 | callckq

Dear Davef, Thanks for your input...The crack happen at the pad/solder ball interface..Pls review the new thread that I post just now with title called "BGA BALL CRACK AT PAD/SOLDER BALL INTERFACE" Thanks!

BGA crack and strain gauge measurement

Electronics Forum | Mon Nov 27 08:05:50 EST 2006 | davef

There is no standard for a strain gage measurement of allowable deflection of a board or a fixture. It's possible that your fixture is causing the BGA cracking that you see. What protion of the BGA is cracking? If it is the solder connection, sear

solder joint problem

Electronics Forum | Fri Jul 26 08:25:25 EDT 2013 | emeto

If there is a way to pre-tin the parts, that might help in forming better joint with gold.

solder joint appearance

Electronics Forum | Thu Jul 29 21:11:13 EDT 2004 | davef

Could be lots of things. With limited information about temperatures, solder alloy, and cleaning; we'll swing for the fence that you got these solder connections very hot. So hot that Pb oxide is dominating the solder joint surface instead of the

SMD solder joint calculation

Electronics Forum | Terry Burnette |

Wed Jan 16 15:21:48 EST 2002

solder joint problem

Electronics Forum | Fri Jul 26 05:14:38 EDT 2013 | anilw2006

We had a solder joint problem in gold plated PLCC68 ic. We do double sided reflow process with Cookson OL107F paste. First we do top with paste and second with glue process.The solder joint shape and wetting looked normal.In the process of testing

Reliability of solder joint

Electronics Forum | Thu May 26 21:09:01 EDT 2005 | thaqalain

The reliability of a Gullwing component solder joint is in question when insufficient solder is evident: *at the heel of the lead *at the toe of the lead *none of the above

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