Electronics Forum: solder joints reliability (Page 1 of 370)

Re: reliability of epoxy

Electronics Forum | Mon Aug 24 07:16:52 EDT 1998 | Paul Horan

| | | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and

Re: reliability of epoxy

Electronics Forum | Thu Aug 06 10:30:41 EDT 1998 | Mike

| | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and t

Re: reliability of epoxy

Electronics Forum | Fri Aug 07 02:32:09 EDT 1998 | P.L. Sorenson - Technical Consultant

| | | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and

Re: reliability of epoxy

Electronics Forum | Mon Aug 24 07:12:20 EDT 1998 | Paul Horan

| | | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and

Voids in thru-hole solder joints

Electronics Forum | Tue Nov 13 12:25:12 EST 2007 | gradloff

I have a thick board with ground planes that will be soldered by hand with a mildly active solder/flux. X-ray confirmed that solder was added to the top of the joint causing a void between the bottom and top solder joint. Other than the mildly acti

wrinkles solder joints after double reflow

Electronics Forum | Mon Mar 22 09:37:28 EST 2004 | ellis

After 2nd time reflow of double reflow, wrinkles solder joints found on SOIC and SOT components.(only happen on the components at the underside of pcb during reflow, top side components dont have this problem) is this due to the reflow process proble

Re: BGA rework and reliability

Electronics Forum | Fri Oct 30 15:09:44 EST 1998 | ChungPark

| Dear all, | | What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rew

need IPC standards for lead free solder joint reliability tests

Electronics Forum | Thu Dec 09 15:19:21 EST 2004 | nrocco

Can anyone point me in the direction to find some IPC standards for lead free solder joint reliablity tests, such as shear tests, pull tests, vibe tests, enviroment tests, etc. I need to know what the specs. are on all aspects of reliability and how

need IPC standards for lead free solder joint reliability tests

Electronics Forum | Thu Dec 09 17:45:27 EST 2004 | davef

You're correct. There is no criteria for no-lead, but there none for SnPb, either. Solder joint strength in pull/shear will vary with lead geometry, solder volume, lead metal/metallization, the way the test is done.

Re: BGA ball size reliability

Electronics Forum | Fri May 07 17:02:01 EDT 1999 | Earl Moon

| On 1.27mm (0.050 inches) Standard Ball Grid Array's. | The ball size diameter starts at approximately 0.025 inches. | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? | | This

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