Electronics Forum | Tue Oct 19 19:25:40 EDT 1999 | Jeff Sanchez
Carol, I think the guys are right about you stand off problem but I want to address the wrinkleing of your masking. Although I think the temps you are subjecting the board to are very high and more than likely creating problems of their own. I th
Electronics Forum | Wed Dec 18 10:10:07 EST 2002 | davef
No, sorry not on "Dave's Bookshelf". My basis is a study done at IBM. I reference it here: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=4941Message19050 Responding differently, you're correct. If you have a
Electronics Forum | Mon Feb 08 20:09:49 EST 2010 | davef
Woody: Consider using test BGA with no chip in, but daisy chains that you can monitor. After soldering, run environmental tests and follow with electrical tests to determine if the product concept is good enough.
Electronics Forum | Tue Jan 30 03:44:17 EST 2007 | frank63
Thank you for feedback and comment. We are trying this again, increasement of solder temp to reach 210-215 peak temp. This is also our norml guideline, but in the past the colleagues had observed problem with that PCB, so reduced it. I let you kno
Electronics Forum | Wed Jan 24 22:48:59 EST 2007 | frank63
Hello, we are facing some troubles with BGA opens in our production. PCB are both side popolated with BGA. BGA is array of 26*26, with some 6*6 center balls. PCB has 2 reflow processes, 4 pcs of BGA on each side. Now we are partly observing opens
Electronics Forum | Mon Aug 09 04:15:33 EDT 1999 | Jacqueline Coia
I am having cleaning problems when processing PCB's which have TAIYO solder mask on them. After processing, hand soldering and cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tide marks etc. Other soldermasks do no
Electronics Forum | Fri Jan 29 16:17:13 EST 2021 | donnie15
The impact is low on larger pitches and pad sizes. as things get to the .4mm pitch the pad differences start affect your ball size and yields. The trace size going into the pads and the solder mask relief can cause some odd shaped pads with signif
Electronics Forum | Thu Dec 09 07:46:42 EST 2004 | davef
We did this for BGA pads, but have not thought about other types. So, this may or may not apply for those. Pad defined by:||Advantages||Disadvantages Non-solder mask||No point-of-stress concentration at edge mask and solder ball||Smaller pads have
Electronics Forum | Wed Jan 05 14:45:14 EST 2000 | Hoyt Moore
Does anybody know how to remove solder mask from pads that were masked over.
Electronics Forum | Fri May 21 09:48:30 EDT 2010 | tomg_fla
Am looking for a dispensable water soluble solder mask or peelable solder mask that can be dispensed and be run through a reflow oven with no swelling or degradation. Any leads on any materials or manufacturers to contact?