Electronics Forum | Sat Sep 21 23:38:06 EDT 2002 | ivanchu
I got one problem from my production line recently. One 0.5mm pitch QFP IC have been used on my PCBA. Actually, the defect was happened in randomly. Sometime, we got the fillet completely but sometime is not. The solder joint look like is good, but t
Electronics Forum | Sun Sep 22 09:36:04 EDT 2002 | davef
Sometimes the cut end of QFP leads have corrosion that is very difficult to solder. If this is what you're talking about, it is not a defect according A-610C, 6.5.2, Exposed Basis Metal
Electronics Forum | Tue Sep 24 07:42:36 EDT 2002 | Yannick
Hi, In your message ou talk about the QFP toe, we have some problems with that in our facilitie, Do you have some ideas to solve thise kind of problem? Thank You Yannick
Electronics Forum | Sat Sep 28 05:30:44 EDT 2002 | ivanchu
Stencil cleaning process is taking by machine every 15 boards. We are using wet, vaccune, Dry, Dry cleaning process. The aperture of the stencil is fullfil the aspect ratio.
Electronics Forum | Tue Sep 24 12:58:27 EDT 2002 | dragonslayr
Although focusing on solderability may be the right answer, I wonder if you are satisfied that co-planarity is not the root cause. With random events of contact opens, this may be the case. Cleanliness of the stencil can also be a source of your pr
Electronics Forum | Mon Sep 23 03:12:01 EDT 2002 | surachai
We encounter this problem also , I know that it 's acceptable per IPC standard but sometime it fail at ICT and FCT , then this problem should be prevent , we found it with QFP 16 mil pitch and the defect looklike negative wetting at the front of lead
Electronics Forum | Mon Sep 23 22:31:48 EDT 2002 | davef
Comments are: * It�s interesting, but not surprising that your time above liquidous varies around the sides of this component. * You are correct in thinking that it is better to reduce than to increase the temperature differences around the component
Electronics Forum | Tue Oct 03 09:23:55 EDT 2006 | kenscj
We are encountering BGA solder open connection. At Functional Test, the board failed. Debug guy diagnosed this BGA open connection (2 locations), by using multimeter. Under 5DX inspection, there is connection. Take the board for localised reflow at
Electronics Forum | Tue Sep 07 12:45:47 EDT 1999 | Brad Kendall
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Are you having a problem with the joint openning up after reflow. Like it was soldered after the reflow process, but at final test is not? I had this pr
Electronics Forum | Sun Sep 05 12:59:48 EDT 1999 | Dean
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Single sided BGA assy? Or double sided BGA assy (BGA's on both sides)? I have processed double sided (MIrror assy.) bga assemblies and can tell you it is
