Electronics Forum: solder paste issues gold padas (Page 1 of 8)

SMT gold plated components

Electronics Forum | Wed Aug 06 16:35:31 EDT 2003 | Carol

This is an old topic, but keeps coming up. Solderability and reliability issues with SMT gold plated terminations when used with tin/lead solder paste/hassle finish PWB. I need to know which standard (mil, IPC, J-STD??) tells you all about the probl

Re: gold embrittlement on paste in hole 30 micro in. gold plated lead

Electronics Forum | Fri May 28 17:44:51 EDT 1999 | Glenn Robertson

| I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is abo

gold embrittlement on paste in hole 30 micro in. gold plated lead

Electronics Forum | Fri May 28 17:30:35 EDT 1999 | Dave Clements

I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is about

Re: Noclean soldering to gold

Electronics Forum | Tue Dec 07 16:34:54 EST 1999 | Russ

Wolfgang, I appreciate your continued feedback! The main reason that I shortened the Time Above Liquidous (TAL) was it appeared that I was burning off all of the flux from the paste. By shortening the TAL to 45 seconds and decreasing peak temp to

Ag/Pd termination reflow soldering issues

Electronics Forum | Wed Apr 18 08:14:20 EDT 2007 | davef

Silver palladium termination * AgPd-terminated capacitors are designed for conductive adhesion. Reflow or wave soldering is not recommended. [EPCOS Multilayer ceramic capacitors, Soldering directions, October 2006] * CONDUCTIVE EPOXY BONDING. Epoxy c

Re: Micro balls on gold fingers

Electronics Forum | Tue May 19 12:29:59 EDT 1998 | Richard Jackson

| Richard, | You may be encountering solder paste contamination | on the assembly during the printing process. Solder | will reflow on tin/lead plated lands therefore invisible. | If you are washing the assembly prior to inspection | then you are

62/36/2Ag solder paste on imersion silver plated PCBs

Electronics Forum | Tue Apr 09 00:26:46 EDT 2002 | craigj

Are currently investigating a change of solder paste for various reasons and are considering a move from 63/37 to using 2% silver solder paste for increased long term reliabilty of solder joints with gold finish PCBs and to further reduce reflow temp

solder black stains after reflow

Electronics Forum | Wed Sep 26 12:16:44 EDT 2012 | bwjm

Hi Guys,recently i am facing an issue. Refer to the attached photo. This PCB is high RF speed, gold immersion single layer. After reflow, my solder seems to have black stains on it. I tried with SAC305 paste water soluble and no-clean, both results a

Re: vibration during solder reflow

Electronics Forum | Sun May 23 07:13:56 EDT 1999 | Scott Cook

| Has anyone had any experience or data using vibration during the reflow process. | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process worked v

Can we hide extra long pad with solder mask ?

Electronics Forum | Fri Nov 09 16:58:30 EST 2001 | davef

Go for it!!! You were unspecific, but adding mask to a completed board could cause: * Increased paste thickness, if you have double thickness of solder mask. * Wrinkled and lifted solder mask under the component, if the solderability protection of

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