Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Wed Jul 17 02:32:13 EDT 2002 | computer
Hi, Anybody with a solution on solder balls on gold pad. I have tried the following a) Check cleanliness of solder paste printing area b) Clean stencils on 1 clean per 2 prints c) Use N2 on the reflow oven. Any other methods...
Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef
Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the
Electronics Forum | Thu Jul 20 03:00:53 EDT 2006 | reypal
If you are using SMT machine for component placement you may check your nozzle where in some cases solder paste stuck to it and during placement will easily get into gold pad area. otherwise you have use kapton tape in order not to expose those pads.
Electronics Forum | Mon Oct 23 06:51:36 EDT 2000 | fastech6
I have a problem with solder getting into exposed gold pads. What is the best rework procedure for removing the solder and restoring the gold condition of the pad? At the moment, we are also covering the gold pad with kapton tape prior to solder
Electronics Forum | Mon Jun 25 20:37:14 EDT 2001 | davef
You are 100% correctamundo that the pad on PCB should be the same as the pad on the BGA interposer, but let�s not expend that thinking to the aperture of your solder paste stencil, right away. Generally, paste on large pitch BGA is often 1:1, but as
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Mon Aug 24 21:04:58 EDT 1998 | Karlin
| | Hi, | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | We have rule out the possibility of not printing any solder
Electronics Forum | Mon Aug 24 08:34:14 EDT 1998 | JUSTIN MEDERNACH
| Hi, | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | We have rule out the possibility of not printing any solder paste
Electronics Forum | Tue Aug 25 08:51:16 EDT 1998 | Justin Medernach
| | | Hi, | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | We have rule out the possibility of not printing any
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