Electronics Forum: solder paste qfp (Page 1 of 683)

solder mask between qfp pads

Electronics Forum | Sat Aug 14 17:39:37 EDT 1999 | Gerry S.

One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with the

qfp reflow problems

Electronics Forum | Fri Apr 16 08:49:07 EDT 2004 | Chris Lampron

Hi Barry, Your best course of action is to perform a thermal profile and determine exactly what the times/temps are in these locations. Try to match your profile to the recommendations of your solder paste. (Time between 130-160, Time over 183 and m

qfp reflow problems

Electronics Forum | Thu Apr 15 16:07:37 EDT 2004 | barry

Hi there all, we are having problems with 2 qfp devices. grainy poorly reflowed solder joints. One 100 pin .5mm pitch, and one 64 pin .5 mm pitch . Both of these devices have a thermo pad on the back of them (pad area soldered to back of device)which

Less solder with fine pitch qfp

Electronics Forum | Mon Sep 29 11:44:39 EDT 2008 | manishc

We r facing less soder problem with qfp,using 4 mil tencil and lead free paste,tried out different combinations of reflow profile,can anybody suggest?

Re: solder mask between qfp pads

Electronics Forum | Mon Aug 16 04:47:04 EDT 1999 | Charles Stringer

One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact wit

Re: solder mask between qfp pads

Electronics Forum | Mon Aug 16 04:34:54 EDT 1999 | Earl Moon

One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with

Re: solder mask between qfp pads

Electronics Forum | Sun Aug 15 14:56:03 EDT 1999 | Dean

One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with th

Re: solder mask between qfp pads

Electronics Forum | Mon Aug 16 07:54:05 EDT 1999 | Peter Barton

One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact w

Re: solder mask between qfp pads

Electronics Forum | Wed Aug 18 21:03:41 EDT 1999 | Dave F

One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact

Re: solder mask between qfp pads

Electronics Forum | Fri Aug 20 03:19:22 EDT 1999 | PeterB

One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate conta

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