Electronics Forum: solder paste type4 ball size (Page 1 of 23)

minimum solder ball (bead) size

Electronics Forum | Wed Jun 07 10:56:38 EDT 2006 | Chunks

In the past, I would normally tell out highly talented inspectors to leave the balls there. The were trapped in the flux residue and were hard to remove. Never caused a problem. But then there was an incident where someone had the bright idea to u

Re: BGA ball size reliability

Electronics Forum | Fri May 07 17:02:01 EDT 1999 | Earl Moon

On 1.27mm (0.050 inches) Standard Ball Grid Array's. The ball size diameter starts at approximately 0.025 inches. If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? This

Re: BGA ball size reliability

Electronics Forum | Thu May 13 18:36:55 EDT 1999 | Andrew Wulff

On 1.27mm (0.050 inches) Standard Ball Grid Array's. The ball size diameter starts at approximately 0.025 inches. If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable?

Re: BGA ball size reliability

Electronics Forum | Wed May 12 20:32:14 EDT 1999 | Earl Moon

Earl you posted a message on 1-14-99 about converting to VOC free flux. Have you completed your evaluation? Could I get a copy of any data supporting your conversion to VOC free? Thanks WDR WDR, We are awaiting the latest dat

solder ball

Electronics Forum | Tue Jun 04 17:21:22 EDT 2002 | jasonfang

I found solderballs are around chip components (on one side of middle area), I checked gerber data, solder paste of aperture on the stencil for these chip components have 5% reduction to solder land on PCB, shape of solder land are square, not home p

solder ball

Electronics Forum | Thu Jan 02 10:31:48 EST 2020 | slthomas

It is strange that you're having issues while using the same process parameters (including stencil) that worked successfully before. It doesn't guarantee that it's not one of those parameters changing in a manner that's not apparent, but it does sugg

Stencil and paste used for .4mm pitch csp component ball size .3mm?

Electronics Forum | Fri Aug 24 13:21:59 EDT 2018 | babe7362000

What do others use as far as solder paste type, stencil thickness and aperature size for a .4mm Ball Pitch CSP. Ball diameter is .3mm. Please let me know your thoughts or what you use. Thanks

Stencil and paste used for .4mm pitch csp component ball size .3mm?

Electronics Forum | Thu Aug 30 13:06:10 EDT 2018 | emeto

I don't know your board, but for this specific part: 10mil round aperture on a 3.5mil stencil with type 4 paste wold be ideal

solder ball after reflow owen

Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks

Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a

Problems with .45 mil ball diameter BGA....

Electronics Forum | Wed Apr 27 07:16:40 EDT 2005 | jdumont

Thanks a lot guys. The part dims are in mm by the way. So last night i was looking at the .pcb file and saw that the pad size and stencil are both .013" while the ball on the BGA is .018" (sorry for switching from metric). Is this ok or can i have en

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