Electronics Forum | Sat Nov 03 09:39:27 EDT 2007 | davef
Flux exhaused or CSP never came to peak temperature * BGA balls don't combine with the solder => Flux exhaused or BGA balls never came to peak temperature * 0402 surface looks like many tin balls piled together => Flux exhaused Start your thermal
Electronics Forum | Fri Jul 26 05:14:38 EDT 2013 | anilw2006
We had a solder joint problem in gold plated PLCC68 ic. We do double sided reflow process with Cookson OL107F paste. First we do top with paste and second with glue process.The solder joint shape and wetting looked normal.In the process of testing
Electronics Forum | Mon Sep 08 09:59:56 EDT 2008 | vladig
Here we go with another "solderability problem". How do you know the pads on the bare PCB are oxidized? Just based on its colour? If that is the root cause, then why ohter parts on the same board are fine? If you want to solve the problem, get it's
Electronics Forum | Wed Sep 10 09:34:25 EDT 2008 | realchunks
In the real world where I work, I turn knobs (really key boards, mouse, or touch screens) every day to solve solder related problems. I can tell you exactly why I have to for each one I adjust.