Electronics Forum | Thu Nov 03 08:34:25 EST 2005 | Slaine
Hi We currently use a small amount of Alloy : 43Sn 43Pb 14Bi Flux: RMA-51AC, Metal : 88.5%. We use it for reworking a product and only consume about 100g per year, we are in the middle or ordering in some more paste but the MOQ is 500g. Is it possibl
Electronics Forum | Thu Nov 03 09:20:29 EST 2005 | russ
Unforunately, the only one who can give you that answer is the manufacturer. They are the only ones who know what is in their paste and how it reacts to different situations and conditions.
Electronics Forum | Wed Apr 11 10:28:02 EDT 2001 | davef
What's the issue? Solderability or performance of the component
Electronics Forum | Wed Apr 11 06:56:20 EDT 2001 | brownsj
Most of the component vendors I've dealt with will guarantee the solderability of the terminations for three years if the components are still packaged in a full reel. If the reel is part used we've kept them for 1 year and then used a wetting balanc
Electronics Forum | Wed Apr 11 06:56:46 EDT 2001 | brownsj
Most of the component vendors I've dealt with will guarantee the solderability of the terminations for three years if the components are still packaged in a full reel. If the reel is part used we've kept them for 1 year and then used a wetting balanc
Electronics Forum | Thu Apr 12 20:27:10 EDT 2001 | davef
Tantalum caps degrade over time. You should not be seeing "chipped-off & cracks" regardless of the age. This should not be a shelf-life issue, unless you are storing them in an aquarium. Tell us the story. Solderability is a shelf-life issue and
Electronics Forum | Fri Sep 09 05:29:25 EDT 2016 | jasltd
simpel answer is yes it will need to be baked, the typical shelf life for a sealed component assuming it has been sealed would be a max of 2 years but some are shorter. The bugger problem with the device may well be solderability of the device!
Electronics Forum | Thu Aug 29 17:45:54 EDT 2002 | nifhail
What are other testing/process step that we should do if we where to use the old date code QFPs other than solderability and baking ? What is the plating composition normally %? lead, % tin etc. I have my policy not to accept the more than 12 mont
Electronics Forum | Mon Jan 05 18:03:04 EST 2004 | davef
You may struggle finding the information that you seek, because there is so much variability in the design and fabrication of boards. * What is the purpose of such a test? * What product type sees such an use environment? Consider using the guidelin
Electronics Forum | Wed Jun 25 12:13:31 EDT 2003 | russ
A lot of it depends upon what the lead terminations are and the storage conditions. For example if they are tin you will run into trouble. We have used all types of parts that are all ages (We just started doing BGAs that are 5 years old.) I don't
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