Electronics Forum | Tue Aug 26 21:12:24 EDT 2003 | iman
depends if your water wash process is manual or automation? important is the water residue inside the via holes is adequately blown out. As long as the water-flux residue is out, testing down the line should not be a issue, at least from theory and o
Electronics Forum | Sun Mar 07 17:53:39 EST 2004 | Ken
Increasing the metals loading may help. But may cause issues elsewhere. Unsure of your exact process....but may work. Is anyone dispensing solder paste onto BGA pads...how is voiding in comparison???
Electronics Forum | Mon Apr 05 10:37:49 EDT 2004 | Verm.
A customer of ours has requested information on components tested using a torque meter. We have the facility to do this but it is a very uncommon practise. Does anyone else do this during their manufacturing process and if so is there a procedure to
Electronics Forum | Wed Apr 28 22:35:32 EDT 2004 | davef
We can clean the blank out of LARGE BGA. [Cleaning small BGA is a whoooole nuther issue.] But before we get into that, what's the problem and its breadth? Why are you getting poor wetting? What's the story on the components, board, process materia
Electronics Forum | Wed Jul 07 02:20:48 EDT 2004 | Koki
Please let me know exactly the Koki specification that has managed to solve the balling issue and we can look at the level of residue or the cosmetic may be what you wish to improve.
Electronics Forum | Sun Aug 01 11:39:41 EDT 2004 | Andrew
I am seeing high rate of open joint at NexLev connector and also BGA warpage issue with 52 mm Hyper BGA.anyone has the same experience?
Electronics Forum | Fri Dec 03 07:57:02 EST 2004 | Bob R.
NEMI kicked off a project within the last month or so to look at this specific issue.
Electronics Forum | Mon Nov 01 07:39:49 EST 2004 | Bob R.
Yes, you can place a BGA in flux and get good reflow. However, depending on BGA type and size you should expect a yield loss due to coplanarity issues. Having the paste on the pad definately helps your yield.
Electronics Forum | Tue Feb 08 11:09:44 EST 2005 | jdumont
Hi all, we're preparing for the switch to lead free and I was wondering how dangerous/harmful to our new wave oven it would be to run tin lead parts through the no lead wave. Will the lead build up and cause issues?
Electronics Forum | Fri Apr 29 07:09:10 EDT 2005 | jdumont
Really you think the 256 is the issue eh? I have some a sample of the type 4 powder size coming in hopefully today. Hopefully that will help, if not its back to the old solder eval drawing board. I love my job...
