Electronics Forum | Tue Sep 24 11:10:07 EDT 2002 | Gregg Temkin
I�d appreciate assistance in trying to resolve a placement/soldering problem. My company has designed a board which uses a large number of 0402 LED�s that are .028� high. The LED�s need to be soldered so that they point straight up and are not til
Electronics Forum | Thu Dec 07 17:25:58 EST 2017 | davef
Help me understand your issue better ... Are you looking to: * Improve your products that are used for thermal cycling testing of products of other companies? * Change your production materials so that you pass thermal cycling testing of your produ
Electronics Forum | Thu Apr 22 18:07:38 EDT 1999 | Tom B.
| On various PCB's after building processes,such as reflow, flowsolder and wash. The soldermask on the PCB's have become discoloured, like a 'marble' effect all along the solder side of the board, it is lighter in contrast than normal, although when
Electronics Forum | Sat Feb 20 09:56:22 EST 1999 | Tufty
| We are in the process of getting into no-clean paste and fluxes. One important issue in this is sodler balling. I have heard some people say that having a matte finish would help in having lesser solder balls and that the solder balls would not b
Electronics Forum | Tue Dec 29 09:46:37 EST 1998 | Darryl Schlosser
| We are looking into a SRS machine, and one question keeps coming up, "If we pull out all the solder, will the recycling company refuse to purchase the remaining dross?" | | Anyone who out there that uses a SRS machine(Solder Recovery System) I wou
Electronics Forum | Thu Oct 01 13:31:09 EDT 1998 | FRANK
Assuming that you do not have a solderability problem with the board or part it sounds like you are not pumping the solder up high enough to contact the board plus push into the board by about 1.8mm. Are you using a chip wave in front of the normal
Electronics Forum | Fri Jul 10 13:58:49 EDT 1998 | Bob Willis
The parameters which effect the problem you are having are flux and contact time try first increasing the flux you are applying. Next reduce the contact time in the wave by adjusting the back flow plate. If the problem is a jig design check out the j
Electronics Forum | Mon Apr 13 17:03:40 EDT 1998 | EFData
We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X 75
Electronics Forum | Thu Apr 09 14:05:54 EDT 1998 | Earl Moon
| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe
Electronics Forum | Sun Oct 28 23:32:25 EST 2001 | flynhi34
Thanks for the info on the printers. I have printed conductive epoxy on Dek 265 with great success in the past. The issue I have is that I need to attach with both epoxy and solder on the same side of the PCB. I could double print. Print conductiv